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SA605DK/01

NXP Semiconductors

SA605DK/01 by NXP Semiconductors

SA605DK/01 by NXP Semiconductors is an audio single chip receiver with 20 terminals, operating temperature range of -40 to 85 °C. It offers a signal to noise ratio of 73 dB for FM demodulation applications. The small outline package with gull wing terminals makes it suitable for industrial-grade receivers requiring high output voltage and low profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,610 parts In-Stock

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Anansix

USA . 1,091 parts In-Stock

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Vyrian

USA . 155 parts In-Stock

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155

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Extreme Components

USA . 6 parts In-Stock

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AZTECH Wire

Italy . 624 parts In-Stock

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$14.087

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Ampacity Inc.

Singapore . 1,623 parts In-Stock

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$18.800

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One Stop Electronics

USA . 1,108 parts In-Stock

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$20.800

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Lixinc

USA . 9,152 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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UNI Independent Distributors

Spain . 4,049 parts In-Stock

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Bastille Electronics

Australia . 3,684 parts In-Stock

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Corphita

USA . 3,587 parts In-Stock

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Kepictronics

USA . 3,200 parts In-Stock

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Perfect Parts

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Overview

Experience crystal clear audio quality like never before with the SA605DK/01 by NXP Semiconductors. This receiver IC boasts unmatched precision and reliability, thanks to its cutting-edge manufacturing techniques. Ideal for a wide range of applications, this product offers exceptional value and performance. Whether you're a professional or an enthusiast, the SA605DK/01 delivers superior sound and functionality that will elevate your audio experience to new heights. Unlock the full potential of your devices with this top-of-the-line receiver IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this receiver IC lightweight and durable, ideal for portable audio applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

The rectangular shape of the package optimizes space utilization on the PCB, making it suitable for compact designs.

General IC Type: AUDIO SINGLE CHIP RECEIVER

This single chip receiver simplifies the circuit design, reducing component count and overall cost.

No. of Terminals: 20

With 20 terminals, this receiver IC provides flexibility for various connection options and functions.

Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design with shrink pitch enhances PCB layout options and saves valuable board space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this receiver IC suitable for both hot and cold operating conditions.

Terminal Position: DUAL

Dual terminal positions offer versatility in PCB layout and facilitate easy connection to other components.

Maximum Seated Height: 1.5 mm

The low seated height allows for a slim profile, making it suitable for applications with space constraints.

Technical Specifications

Receiver ICs SA605DK/01 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

4300 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.5 mm

Nominal Signal to Noise Ratio (FM):

73 dB

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA605DK/01 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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