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LM1865N

Texas Instruments

LM1865N by Texas Instruments

LM1865N by Texas Instruments is an audio demodulator IC with FM demodulation type. It offers a nominal signal to noise ratio of 84 dB and harmonic distortion of 0.15%. This receiver IC, housed in a rectangular plastic/epoxy package, is ideal for applications requiring high-quality audio demodulation in electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 4,441 parts In-Stock

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Digiode

USA . 3,643 parts In-Stock

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Anansix

USA . 1,519 parts In-Stock

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1,519

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MRC Electronics

USA . 237 parts In-Stock

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237

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MISTER SPROCKETS

USA . 18 parts In-Stock

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ABC Electronics Ltd.

UK . 4 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,356 parts In-Stock

1+ parts

$1.263

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$2.029

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2,356

$1.263

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$2.029

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DigiPath Technology Company

USA . 1,744 parts In-Stock

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$1.391

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$1.279

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1,744

$1.391

$1.279

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ChromeModa Solutions

Germany . 6,109 parts In-Stock

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$1.419

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$1.164

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6,109

$1.419

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IDEA Electronic Components Group

UK . 202 parts In-Stock

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$1.419

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$1.277

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202

$1.419

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$1.277

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AZTECH Wire

Italy . 564 parts In-Stock

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$11.792

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564

$11.792

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One Stop Electronics

USA . 1,596 parts In-Stock

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$13.800

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Corphita

USA . 550 parts In-Stock

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Overview

Discover a new world of audio excellence with the LM1865N by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in every product. The LM1865N falls under the category of Receiver ICs, offering unmatched performance in audio demodulation. With minimal harmonic distortion and a high signal to noise ratio, this IC guarantees crystal-clear sound quality. Whether you're designing a radio receiver or audio system, the LM1865N provides the value, benefits, and advantages you need to bring your projects to life. Elevate your audio experience with the LM1865N today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various environmental conditions.

General IC Type: AUDIO DEMODULATOR

Being an audio demodulator, this IC is designed specifically for processing audio signals, ensuring high-quality sound output.

Harmonic Distortion: 0.15 %

With low harmonic distortion, this IC delivers clean and accurate audio signals without unwanted interference.

No. of Terminals: 20

Having 20 terminals allows for flexibility in connecting the IC to other components, enabling diverse applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand heat-intensive conditions, ensuring reliable performance.

Minimum Operating Temperature: -20 °C

The ability to operate at low temperatures makes this IC suitable for use in cold environments without compromising functionality.

Width: 7.62 mm

The compact width of this IC allows for space-saving designs in various electronic devices.

Nominal Signal to Noise Ratio (FM): 84 dB

With a high signal-to-noise ratio, this IC delivers clear audio signals with minimal background noise.

Minimum Supply Voltage (Vsup): 7.3 V

The low minimum supply voltage enables energy-efficient operation of the IC, reducing power consumption.

Demodulation Type: FM

Being designed for Frequency Modulation (FM) demodulation, this IC is ideal for processing FM audio signals efficiently.

Technical Specifications

Receiver ICs LM1865N attributes and parameters. Explore more Receiver ICs devices from Texas Instruments

Specs

General IC Type:

Demodulation Type:

FM

Harmonic Distortion:

.15 %

JESD-30 Code:

R-PDIP-T20

Length:

26.075 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Nominal Output Voltage (FM):

320 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Nominal Signal to Noise Ratio (FM):

84 dB

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

7.3 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LM1865N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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