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PCD3312CP

NXP Semiconductors

PCD3312CP by NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$3.950

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 600 parts In-Stock

1+ parts

$3.950

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600

$3.950

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DF Sales Co.

USA . 600 parts In-Stock

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$3.950

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600

$3.950

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Digiode

USA . 3,691 parts In-Stock

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3,691

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Vyrian

USA . 3,399 parts In-Stock

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Anansix

USA . 2,639 parts In-Stock

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Freddi Giovanni

Italy . 540 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 242 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 241 parts In-Stock

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Q Components

USA . 206 parts In-Stock

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Avant Electronics Limited

UK . 147 parts In-Stock

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Pride Electronics

USA . 49 parts In-Stock

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Halfin

Belgium . 49 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 31 parts In-Stock

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Component Sense

UK . 20 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,223 parts In-Stock

1+ parts

$872.000

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UNI Independent Distributors

Spain . 8,111 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Assy Fe

Spain . 1,020 parts In-Stock

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Corphita

USA . 726 parts In-Stock

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Infinite Electronics LLP (Excess)

. 439 parts In-Stock

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439

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Kepictronics

USA . 229 parts In-Stock

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229

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Futuretech Components

Singapore . 190 parts In-Stock

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190

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Technical Specifications

Telephone Line ICs PCD3312CP attributes and parameters. Explore more Telephone Line ICs devices from NXP Semiconductors

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDIP-T8

Length:

9.5 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.0009 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

PCD3312CP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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