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S2579-S

Onsemi

S2579-S by Onsemi

The Onsemi S2579-S is a Telephone Line IC with 16 terminals, CMOS technology, and 5V supply voltage. It features a small outline package style suitable for telephone dialer circuits. Operating temperature range from 0 to 70 °C makes it ideal for commercial telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,434 parts In-Stock

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Digiode

USA . 400 parts In-Stock

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400

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Prism Electronics

USA . 198 parts In-Stock

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Problanco Electronics

Mexico . 8,163 parts In-Stock

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Kulean Microsystems

USA . 7,316 parts In-Stock

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SupplyDigital Components

Austria . 4,023 parts In-Stock

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TANS Electronics

Latvia . 1,774 parts In-Stock

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Corphita

USA . 575 parts In-Stock

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Corohmni

South Africa . 346 parts In-Stock

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Perfect Parts

USA . 222 parts In-Stock

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UHIMA Technologies

Türkiye . 190 parts In-Stock

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Overview

Discover the innovative S2579-S by Onsemi, a cutting-edge Telephone Line IC that promises unparalleled quality and reliability. Manufactured by Onsemi, a renowned leader in semiconductor technology, this product is designed to meet the highest industry standards. With a wide range of applications in telecom devices, the S2579-S offers customers unmatched value, benefits, and advantages. Say goodbye to compromises and experience superior performance with the S2579-S.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy installation onto circuit boards, saving space and streamlining the manufacturing process.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the circuit board and easy integration into existing designs.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various circuit configurations and applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can withstand a wide range of environmental conditions, making it suitable for diverse applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in colder environments.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit design and allow for efficient routing of connections.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common and stable power input, making this IC compatible with a wide range of power sources.

Technical Specifications

Telephone Line ICs S2579-S attributes and parameters. Explore more Telephone Line ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

S2579-S Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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