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MC33FS4508CAER2

NXP Semiconductors

MC33FS4508CAER2 by NXP Semiconductors

MC33FS4508CAER2 by NXP Semiconductors is a CAN FD/LIN transceiver with AEC-Q100 screening. Operating from -40 to 125°C, it features a flatpack package style, Gull Wing terminals, and SMARTMOS technology. Ideal for automotive applications requiring high-temperature resistance and reliable network interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,843 parts In-Stock

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2,843

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Digiode

USA . 1,038 parts In-Stock

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Anansix

USA . 460 parts In-Stock

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460

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 626 parts In-Stock

1+ parts

$13.600

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626

$13.600

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Aztec Data Supply Inc.

USA . 4,726 parts In-Stock

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$14.233

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Microchip USA

USA . 4,288 parts In-Stock

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$16.600

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$16.360

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$16.240

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$16.120

4,288

$16.600

$16.360

$16.240

$16.120

Corohmni

South Africa . 633 parts In-Stock

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$16.999

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633

$16.999

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Ampacity Inc.

Singapore . 1,270 parts In-Stock

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$192.000

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One Stop Electronics

USA . 1,491 parts In-Stock

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$907.000

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UNI Independent Distributors

Spain . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,612 parts In-Stock

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Argo Parts USA

USA . 787 parts In-Stock

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Corphita

USA . 784 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock the power of seamless connectivity with the MC33FS4508CAER2 by NXP Semiconductors. Crafted with precision using top-notch materials, this network interface device offers unparalleled reliability and performance. Ideal for various applications, this product ensures smooth communication and data transfer. Experience the value of cutting-edge technology with the MC33FS4508CAER2, providing customers with unmatched benefits and advantages in the world of networking solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the product is resilient and long-lasting.

Surface Mount: YES

Being surface mountable makes installation easier and more compact, suitable for various applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality for automotive applications.

Package Shape: SQUARE

The square shape allows for efficient use of space and easy integration into circuit designs.

No. of Terminals: 48

Having 48 terminals enables connectivity to multiple devices or components for versatile usage.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The various package styles offer flexibility in design and customization options to meet specific requirements.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in cold environments.

Terminal Position: QUAD

The quad terminal position allows for stable and secure connections with other components.

Maximum Seated Height: 1.6 mm

The low seated height contributes to a compact and space-saving design.

Width: 7 mm

The compact width makes the product suitable for applications where space is limited.

Maximum Time At Peak Reflow Temperature (s): 40

The short reflow time ensures quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product is resistant to heat and soldering processes.

Length: 7 mm

The small length contributes to the overall compactness of the product.

Technology: SMARTMOS

Utilizing SMARTMOS technology offers high performance and efficiency in signal processing.

Terminal Form: GULL WING

The gull wing terminal form provides easy soldering and strong mechanical connections.

Telecom IC Type: CAN FD/LIN TRANSCEIVER

Support for CAN FD/LIN transceiver technology enables reliable and high-speed communication in telecommunications applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for precise connections and compact layout design.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating ensures the product's resilience to moisture and humidity, suitable for various environmental conditions.

Technical Specifications

Network Interfaces MC33FS4508CAER2 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Technology:

SMARTMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

MC33FS4508CAER2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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