Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MC33889BPEGR2 by NXP Semiconductors is a Network Interface IC with 28 terminals, operating at -40 to 125°C. It has a supply voltage range of 5.5-18V and data rate of 0.125 Mbps, suitable for automotive applications requiring interface circuitry in compact designs.
Median Price
$6.377
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The plastic/epoxy material used in the package body makes this product lightweight and durable, ideal for applications where weight and durability are important factors.
The ability to be surface mounted makes this product easy to install and saves space, perfect for compact design requirements.
The rectangular shape of the package provides a standardized form factor, making it compatible with a wide range of devices and applications.
With a wide range of power supply options from 5.5V to 18V, this product is versatile and can be used in various power supply environments.
The high number of terminals allows for more connections and functionalities, making this product suitable for complex networking applications.
The small outline package style saves space and enhances portability, making this product a convenient choice for applications with limited space.
The high maximum operating temperature ensures reliability and performance even in extreme environmental conditions.
The low minimum operating temperature allows this product to function efficiently in cold environments, expanding its range of applications.
The terminal finish of TIN provides good conductivity and corrosion resistance, ensuring stable connections and long-lasting performance.
The dual terminal position offers flexibility in installation and allows for more connectivity options, making this product versatile for various networking requirements.
Network Interfaces MC33889BPEGR2 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors
Data Rate:
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Transceivers:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Current:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
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Maximum Time At Peak Reflow Temperature (s):
Width:
MC33889BPEGR2 Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N7002
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LL4148
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
1N4148WS
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
STM32H753ZIT6
STMicroelectronics
STM32H753ZIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20-Ch 16-Bit ADC and 2-Ch 12-Bit DAC channels. With a clock frequency of up to 48 MHz, it is ideal for industrial applications requiring CAN, Ethernet, and USB connectivity. This microcontroller operates b/w -40°C to +85°C temperature range.
1N4148
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
Daco Semiconductor
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
BAV99
Plessey Semiconductors Discrete Components Div
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Shandong Yiguang Electronic Joint Stock
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
KSZ9897RTXI-TR
Microchip Technology
Microchip Technology's KSZ9897RTXI-TR is an Ethernet transceiver with 128 terminals, operating temperature range of -40 to 85°C. It features a matte tin finish, quad terminal position, and thin profile package style. Ideal for industrial applications requiring reliable network interfaces in compact spaces.
TJA1042T/3
NXP Semiconductors' TJA1042T/3 is an AEC-Q100 compliant interface circuit with 1Mbps data rate, suitable for automotive applications. It operates at a voltage of 5V, with a low supply current of 0.07mA. The package style is small outline, making it ideal for space-constrained designs.
VSC8514XMK-03
VSC8514XMK-03 by Microchip: 4 Ethernet transceivers, 1000 Mbps data rate, 605 mA max supply current. Ideal for automotive applications with -40 to 125 °C operating temp range. Chip carrier package style, square shape, surface mount design with 138 terminals.
TJA1044GT/3Z
NXP Semiconductors' TJA1044GT/3Z is a CAN transceiver with 5 Mbps data rate, 8 terminals, and AEC-Q100 screening. It operates at -40 to 150°C, suitable for automotive applications due to its small outline package and high reliability.
RTL8211E-VB-CG
Realtek Semiconductor
Realtek's RTL8211E-VB-CG is a 48-terminal Ethernet transceiver with 1000 Mbps data rate. Operating b/w 0-70°C, it's ideal for network interfaces in commercial applications. This square-shaped chip carrier has a very thin profile and no-lead terminal form, making it suitable for compact designs.
TJA1057GTK/3Z
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
KSZ8995M
Micrel
LAN SWITCHING CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;
KSZ9897STXI-TR
Microchip Technology's KSZ9897STXI-TR is an Ethernet transceiver with 128 terminals in a square flatpack package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. Features include matte tin finish, quad terminal position, and thin profile design for network interfaces.
SN65HVD234DG4
SN65HVD234DG4 by Texas Instruments is a Network Interface IC with 3.3V supply voltage, operating temperature range of -40 to 125°C, and Gull Wing terminal form. It is ideal for automotive applications requiring small outline package style and interface circuit telecom IC type.
LTC2875HS8#TRPBF
Linear Technology
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
KSZ8041FTLI-TR
Microchip's KSZ8041FTLI-TR is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85°C. It features a 48-terminal flatpack package suitable for industrial applications. With a supply voltage of 3.3V and low current draw of 58.3mA, it's ideal for network interfaces in various electronic devices.
MCP2562T-E/MFVAO
MCP2562T-E/MFVAO by Microchip Technology is a CAN transceiver with 1 Mbps data rate. It operates at temperatures ranging from -40 to 125 °C and has a max supply current of 70 mA. This network interface is commonly used in automotive applications.
KSZ8081MNXCA
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
LAN8742-CZ-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
MCP251863T-H/SS
CAN FD TRANSCEIVER;
TJA1052IT/2Y
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): 260;
ISO1042BDWR
ISO1042BDWR by Texas Instruments is a 16-terminal network interface with a small outline package style. It operates in temperatures ranging from -40 to 125°C, making it suitable for automotive applications. The terminal finish is nickel palladium gold, and it has a gull wing terminal form for easy installation.
RTL8201F-VB-CG
Realtek Semiconductor's RTL8201F-VB-CG is a 32-terminal Ethernet transceiver with CMOS technology. Operating at 0-70°C, it has a 3.3V supply voltage and square chip carrier package style. Ideal for network interfaces, it features a very thin profile and no-lead terminal form for compact designs.
AT86RF212B-ZUR
AT86RF212B-ZUR by Microchip Technology is a network interface with 32 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. This telecom IC type chip carrier is ideal for industrial applications requiring low-profile surface mount packages.
TJA1462AT/0Z
NXP Semiconductors' TJA1462AT/0Z is a CAN FD transceiver with 8 Mbps data rate. It operates at a nominal voltage of 5V and has a max supply current of 70mA. This small outline package is suitable for network interfaces in automotive applications.
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MC33664ATL1EG
INTERFACE CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MC33907NAE
MC33907NAE by NXP Semiconductors is a Network Interface IC with 48 terminals, operating b/w -40 to 125°C. It features matte tin finish, quad terminal position, and gull wing form factor. Ideal for automotive applications requiring interface circuitry in compact spaces.
Freescale Semiconductor
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: HLFQFP; Package Shape: SQUARE;
MC33664ATL1EGR2
INTERFACE CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MC33907LAE
MC33907LAE by NXP Semiconductors is an automotive-grade interface circuit with 48 terminals in a square package. It operates b/w -40 to 125°C, suitable for network interfaces. The IC has a low profile, gull wing terminal form, and is surface mountable with a peak reflow temperature of 260°C.
MC33FS6503CAE
CAN FD/LIN TRANSCEIVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Screening Level: AEC-Q100; Peak Reflow Temperature (C): 260;
MC33908LAE
MC33908NAE
MC33FS4507LAER2
CAN FD/LIN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: HLFQFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
MC33FS4507LAE
MC33FS4507LAE by NXP Semiconductors is a CAN FD/LIN transceiver with 2 transceivers. Operating temp range -40 to 125°C, it's AEC-Q100 compliant for automotive applications. Features include quad terminal position, SMARTMOS technology, and flatpack package style.
MC33662BLEFR2
MC33907NAER2
MC33889BPEGR2
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
MC33FS6523CAE
CAN FD/LIN TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
MC33889BPEG
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