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MC33889BPEGR2

NXP Semiconductors

MC33889BPEGR2 by NXP Semiconductors

MC33889BPEGR2 by NXP Semiconductors is a Network Interface IC with 28 terminals, operating at -40 to 125°C. It has a supply voltage range of 5.5-18V and data rate of 0.125 Mbps, suitable for automotive applications requiring interface circuitry in compact designs.

Median Price

$6.377

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 33 parts In-Stock

1+ parts

$6.377

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33

$6.377

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Flip Electronics

USA . 9,000 parts In-Stock

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9,000

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Digiode

USA . 2,953 parts In-Stock

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2,953

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Bristol Electronics

USA . 657 parts In-Stock

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657

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Anansix

USA . 558 parts In-Stock

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558

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Vyrian

USA . 144 parts In-Stock

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144

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,625 parts In-Stock

1+ parts

$6.377

100+ parts

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$6.249

4,625

$6.377

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-

$6.249

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.377

100+ parts

-

1k+ parts

$6.058

10k+ parts

$5.930

1,000

$6.377

-

$6.058

$5.930

Aztec Data Supply Inc.

USA . 149 parts In-Stock

1+ parts

$11.430

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149

$11.430

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Microchip USA

USA . 3,431 parts In-Stock

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$17.362

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3,431

$17.362

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Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$17.471

100+ parts

$15.899

1k+ parts

$14.326

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550

$17.471

$15.899

$14.326

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Corohmni

South Africa . 245 parts In-Stock

1+ parts

$17.588

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245

$17.588

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AZTECH Wire

Italy . 387 parts In-Stock

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$18.940

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387

$18.940

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Component Stockers USA

USA . 978 parts In-Stock

1+ parts

$66.560

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978

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Ampacity Inc.

Singapore . 843 parts In-Stock

1+ parts

$435.000

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843

$435.000

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One Stop Electronics

USA . 1,335 parts In-Stock

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$798.000

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1,335

$798.000

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Corphita

USA . 4,869 parts In-Stock

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4,869

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Argo Parts USA

USA . 4,051 parts In-Stock

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UNI Independent Distributors

Spain . 3,382 parts In-Stock

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3,382

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Overview

Discover the MC33889BPEGR2 by NXP Semiconductors, a cutting-edge solution in the Network Interfaces category. With a focus on quality and innovation, NXP Semiconductors delivers exceptional products designed to meet the needs of customers across various industries. This versatile component offers unparalleled value with its reliable performance, compact design, and wide range of applications. Experience the benefits and advantages of the MC33889BPEGR2 for yourself and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes this product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

The ability to be surface mounted makes this product easy to install and saves space, perfect for compact design requirements.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor, making it compatible with a wide range of devices and applications.

Power Supplies (V): 5.5/18

With a wide range of power supply options from 5.5V to 18V, this product is versatile and can be used in various power supply environments.

No. of Terminals: 28

The high number of terminals allows for more connections and functionalities, making this product suitable for complex networking applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and enhances portability, making this product a convenient choice for applications with limited space.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and performance even in extreme environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function efficiently in cold environments, expanding its range of applications.

Terminal Finish: TIN

The terminal finish of TIN provides good conductivity and corrosion resistance, ensuring stable connections and long-lasting performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and allows for more connectivity options, making this product versatile for various networking requirements.

Technical Specifications

Network Interfaces MC33889BPEGR2 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

.125 Mbps

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.925 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5.5/18

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.045 mA

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

MC33889BPEGR2 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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