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MC33FS4507LAER2

NXP Semiconductors

MC33FS4507LAER2 by NXP Semiconductors

MC33FS4507LAER2 by NXP Semiconductors is a CAN FD/LIN transceiver with 2 transceivers. It operates b/w -40 to 125°C, featuring a flatpack package style and gull wing terminal form. Ideal for automotive applications due to AEC-Q100 screening level and SMARTMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,483 parts In-Stock

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8,483

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Anansix

USA . 621 parts In-Stock

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621

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Digiode

USA . 309 parts In-Stock

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309

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Nova Conductors

Japan . 37 parts In-Stock

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37

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,745 parts In-Stock

1+ parts

$10.800

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3,745

$10.800

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Corohmni

South Africa . 676 parts In-Stock

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$14.619

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676

$14.619

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Microchip USA

USA . 3,815 parts In-Stock

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$15.151

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3,815

$15.151

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AZTECH Wire

Italy . 315 parts In-Stock

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$15.199

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315

$15.199

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Advanced Electronics

New Zealand . 97 parts In-Stock

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$18.521

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$17.595

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$17.595

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97

$18.521

$17.595

$17.595

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Semicontronic

India . 1,096 parts In-Stock

1+ parts

$242.000

100+ parts

$235.950

1k+ parts

$234.740

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1,096

$242.000

$235.950

$234.740

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Ampacity Inc.

Singapore . 481 parts In-Stock

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$317.000

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481

$317.000

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One Stop Electronics

USA . 1,155 parts In-Stock

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$534.000

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$534.000

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UNI Independent Distributors

Spain . 7,560 parts In-Stock

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Continental Prestige Electronics

USA . 5,091 parts In-Stock

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Argo Parts USA

USA . 1,378 parts In-Stock

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Corphita

USA . 718 parts In-Stock

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718

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Discover the cutting-edge MC33FS4507LAER2 by NXP Semiconductors, a top-of-the-line Network Interface that offers unparalleled quality and reliability. With a focus on innovation and excellence, NXP Semiconductors delivers a product that exceeds industry standards. This versatile device is perfect for various applications, providing customers with seamless connectivity and superior performance. Experience the value and benefits of this exceptional product, designed to enhance your technology experience like never before. Elevate your projects with the MC33FS4507LAER2 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and cost-effective solution for network interfaces.

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Ensures high reliability and quality standards for automotive applications.

No. of Terminals: 48

Provides a sufficient number of connections for robust communication within the network.

Technology: SMARTMOS

Utilizes advanced SMARTMOS technology for enhanced performance and efficiency.

No. of Transceivers: 2

Features two transceivers for increased connectivity and data transmission capabilities.

Telecom IC Type: CAN FD/LIN TRANSCEIVER

Supports CAN FD and LIN protocols for versatile communication options in a network.

Technical Specifications

Network Interfaces MC33FS4507LAER2 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Transceivers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Technology:

SMARTMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

MC33FS4507LAER2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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