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MC33FS6523CAE

NXP Semiconductors

MC33FS6523CAE by NXP Semiconductors

MC33FS6523CAE by NXP Semiconductors is a CAN FD/LIN transceiver with 48 terminals, AEC-Q100 screening, and operating temperature range of -40 to 125°C. It comes in a square chip carrier package suitable for network interfaces in automotive applications.

Median Price

$11.245

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 87 parts In-Stock

1+ parts

$5.293

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-

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87

$5.293

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Chip1Stop

Japan . 87 parts In-Stock

1+ parts

$11.200

100+ parts

$7.030

1k+ parts

$6.250

10k+ parts

$5.980

87

$11.200

$7.030

$6.250

$5.980

DigiKey

USA . 211 parts In-Stock

1+ parts

$11.290

100+ parts

$7.537

1k+ parts

$6.861

10k+ parts

-

211

$11.290

$7.537

$6.861

-

Mouser Electronics

USA . 187 parts In-Stock

1+ parts

$11.290

100+ parts

$7.540

1k+ parts

$6.860

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187

$11.290

$7.540

$6.860

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EBV Elektronik

Germany . 250 parts In-Stock

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250

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Distrelec

Netherlands . 250 parts In-Stock

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250

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$8.565

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300

$8.565

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Digiode

USA . 4,283 parts In-Stock

1+ parts

$9.595

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4,283

$9.595

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Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 3,691 parts In-Stock

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3,691

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

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Anansix

USA . 1,203 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 2,865 parts In-Stock

1+ parts

$7.780

100+ parts

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1k+ parts

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10k+ parts

$7.624

2,865

$7.780

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$7.624

Ampacity Inc.

Singapore . 303 parts In-Stock

1+ parts

$8.410

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303

$8.410

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Semicontronic

India . 3 parts In-Stock

1+ parts

$8.410

100+ parts

$8.200

1k+ parts

$8.158

10k+ parts

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3

$8.410

$8.200

$8.158

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Netroflash

USA . 100 parts In-Stock

1+ parts

$8.565

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100

$8.565

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Corphita

USA . 3,572 parts In-Stock

1+ parts

$9.090

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3,572

$9.090

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Aztec Data Supply Inc.

USA . 2,304 parts In-Stock

1+ parts

$14.440

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2,304

$14.440

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Corohmni

South Africa . 234 parts In-Stock

1+ parts

$17.440

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234

$17.440

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Microchip USA

USA . 900 parts In-Stock

1+ parts

$20.440

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900

$20.440

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iodParts Technologies Inc.

India . 13,500 parts In-Stock

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13,500

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Lixinc

USA . 5,330 parts In-Stock

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5,330

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UNI Independent Distributors

Spain . 5,277 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,718 parts In-Stock

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Argo Parts USA

USA . 4,124 parts In-Stock

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S.R.D Solutions

India . 260 parts In-Stock

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Overview

Experience seamless and reliable networking with the MC33FS6523CAE by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-quality Network Interfaces that are perfect for a wide range of applications. Whether you're looking to enhance communication systems or improve connectivity in automotive electronics, this product offers unmatched value, benefits, and advantages. Trust NXP Semiconductors to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount design allows for easy installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and performance in automotive applications, making the product ideal for use in vehicles.

Package Shape: SQUARE

Square package shape enables efficient use of space on the circuit board, making the product suitable for compact designs.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options, making the product compatible with a wide range of devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile design ensures efficient heat dissipation and space-saving characteristics, making the product highly functional in compact setups.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance of 125°C ensures reliable performance even in demanding environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature capability of -40°C allows the product to function effectively in cold climates or industrial settings with low temperatures.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connectivity, enhancing the product's usability and reliability in various applications.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6 mm helps in achieving a slim and compact product design, suitable for space-constrained installations.

Width: 7 mm

A width of 7 mm provides a balance between compact size and ease of handling during installation, making the product versatile and user-friendly.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time of 40 seconds at peak reflow temperature of 260°C ensures efficient soldering processes, enhancing the product's reliability and durability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C allows for effective soldering and component integration, contributing to the product's durability and performance.

Length: 7 mm

With a length of 7 mm, the product maintains a compact form factor while offering sufficient space for terminal connections, making it suitable for various applications.

Terminal Form: NO LEAD

No lead terminal form promotes environmental sustainability and complies with industry standards, making the product eco-friendly and safe to use.

Telecom IC Type: CAN FD/LIN TRANSCEIVER

CAN FD/LIN transceiver type ensures efficient communication and data transfer in telecom applications, making the product ideal for networking and connectivity solutions.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density connections and compact layout designs, enhancing the product's versatility and compatibility with modern devices.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, making the product suitable for indoor and controlled environments where moisture exposure is minimal.

Technical Specifications

Network Interfaces MC33FS6523CAE attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.32SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

MC33FS6523CAE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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