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MC33FS4507LAE

NXP Semiconductors

MC33FS4507LAE by NXP Semiconductors

MC33FS4507LAE by NXP Semiconductors is a CAN FD/LIN transceiver with 2 transceivers. Operating temp range -40 to 125°C, it's AEC-Q100 compliant for automotive applications. Features include quad terminal position, SMARTMOS technology, and flatpack package style.

Median Price

$5.460

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 200 parts In-Stock

1+ parts

$4.218

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200

$4.218

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Newark

USA . 350 parts In-Stock

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$5.460

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350

$5.460

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Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$8.150

100+ parts

$5.000

1k+ parts

$4.370

10k+ parts

$4.140

200

$8.150

$5.000

$4.370

$4.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,015 parts In-Stock

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3,015

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Vyrian

USA . 2,634 parts In-Stock

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2,634

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Flip Electronics

USA . 1,255 parts In-Stock

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Anansix

USA . 1,114 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,992 parts In-Stock

1+ parts

$12.520

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1,992

$12.520

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$14.013

100+ parts

$13.312

1k+ parts

$13.312

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-

200

$14.013

$13.312

$13.312

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Corohmni

South Africa . 40 parts In-Stock

1+ parts

$17.056

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40

$17.056

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Microchip USA

USA . 2,229 parts In-Stock

1+ parts

$17.076

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2,229

$17.076

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AZTECH Wire

Italy . 460 parts In-Stock

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$19.747

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460

$19.747

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One Stop Electronics

USA . 1,080 parts In-Stock

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$361.000

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1,080

$361.000

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Semicontronic

India . 1,056 parts In-Stock

1+ parts

$590.000

100+ parts

$575.250

1k+ parts

$572.300

10k+ parts

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1,056

$590.000

$575.250

$572.300

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Ampacity Inc.

Singapore . 564 parts In-Stock

1+ parts

$779.000

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564

$779.000

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Continental Prestige Electronics

USA . 5,329 parts In-Stock

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UNI Independent Distributors

Spain . 2,532 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Corphita

USA . 506 parts In-Stock

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506

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Argo Parts USA

USA . 277 parts In-Stock

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277

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Overview

Elevate your network interface performance with the MC33FS4507LAE from NXP Semiconductors. Designed with cutting-edge SMARTMOS technology, this CAN FD/LIN transceiver offers unmatched reliability and efficiency. With a wide operating temperature range and AEC-Q100 screening level, this product is ideal for automotive and industrial applications. Experience seamless connectivity and superior quality with NXP Semiconductors - trust in our commitment to innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to impact, making it suitable for various environments.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during production.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, making it suitable for automotive applications.

Package Shape: SQUARE

Compact shape allows for efficient use of space on the circuit board.

No. of Terminals: 48

Provides ample connectivity options for a wide range of networking needs.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Offers versatility in mounting options for flexibility in design.

Maximum Operating Temperature: 125 °C

Can operate effectively in high temperature environments without overheating.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold temperatures, ensuring reliability in various conditions.

Terminal Position: QUAD

Quad terminal configuration provides a stable connection for reliable data transmission.

Maximum Seated Height: 1.6 mm

Low profile design allows for compact integration in space-constrained applications.

Width: 7 mm

Slim width enables efficient use of board space for other components.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper soldering and reflow process for secure connections during assembly.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for reliable solder joints in manufacturing.

Length: 7 mm

Compact length accommodates space restrictions while providing necessary functionality.

Technology: SMARTMOS

Utilizes advanced technology for efficient and reliable networking performance.

Terminal Form: GULL WING

Gull wing terminals provide a secure connection for stable data transfer.

No. of Transceivers: 2

Multiple transceivers allow for simultaneous data transmission, enhancing network efficiency.

Telecom IC Type: CAN FD/LIN TRANSCEIVER

Designed specifically for use in CAN FD and LIN networks, ensuring compatibility and performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density interconnections on the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Network Interfaces MC33FS4507LAE attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Transceivers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Technology:

SMARTMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

MC33FS4507LAE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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