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MC33908LAE

NXP Semiconductors

MC33908LAE by NXP Semiconductors

MC33908LAE by NXP Semiconductors is a Network Interface IC with 48 terminals, operating temperature range of -40 to 125°C. It features matte tin terminal finish, gull wing form, and 0.5mm pitch. Ideal for automotive applications requiring interface circuitry in compact spaces.

Median Price

$11.587

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 160 parts In-Stock

1+ parts

$4.290

100+ parts

$4.200

1k+ parts

$4.120

10k+ parts

-

160

$4.290

$4.200

$4.120

-

Arrow

USA . 8,599 parts In-Stock

1+ parts

$5.586

100+ parts

-

1k+ parts

-

10k+ parts

-

8,599

$5.586

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-

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Chip1Stop

Japan . 5,100 parts In-Stock

1+ parts

$11.587

100+ parts

$8.460

1k+ parts

$7.040

10k+ parts

-

5,100

$11.587

$8.460

$7.040

-

Mouser Electronics

USA . 124 parts In-Stock

1+ parts

$11.810

100+ parts

$8.270

1k+ parts

$7.650

10k+ parts

-

124

$11.810

$8.270

$7.650

-

DigiKey

USA . 150 parts In-Stock

1+ parts

$13.010

100+ parts

$8.763

1k+ parts

$7.997

10k+ parts

-

150

$13.010

$8.763

$7.997

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Verical

USA . 8,599 parts In-Stock

1+ parts

-

100+ parts

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8,599

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,342 parts In-Stock

1+ parts

$4.076

100+ parts

-

1k+ parts

-

10k+ parts

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4,342

$4.076

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$9.270

100+ parts

-

1k+ parts

-

10k+ parts

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50

$9.270

-

-

-

Chip Stock

USA . 15,223 parts In-Stock

1+ parts

-

100+ parts

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15,223

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Vyrian

USA . 2,226 parts In-Stock

1+ parts

-

100+ parts

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2,226

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Semtec, LLC

USA . 250 parts In-Stock

1+ parts

-

100+ parts

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250

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Flip Electronics

USA . 143 parts In-Stock

1+ parts

-

100+ parts

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143

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Anansix

USA . 82 parts In-Stock

1+ parts

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82

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,522 parts In-Stock

1+ parts

$3.650

100+ parts

-

1k+ parts

-

10k+ parts

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2,522

$3.650

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-

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Semicontronic

India . 2,339 parts In-Stock

1+ parts

$3.650

100+ parts

$3.559

1k+ parts

$3.540

10k+ parts

-

2,339

$3.650

$3.559

$3.540

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Corphita

USA . 4,138 parts In-Stock

1+ parts

$3.861

100+ parts

-

1k+ parts

-

10k+ parts

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4,138

$3.861

-

-

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Continental Prestige Electronics

USA . 67 parts In-Stock

1+ parts

$6.860

100+ parts

$4.730

1k+ parts

-

10k+ parts

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67

$6.860

$4.730

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Netroflash

USA . 500 parts In-Stock

1+ parts

$9.270

100+ parts

-

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500

$9.270

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-

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Aztec Data Supply Inc.

USA . 2,972 parts In-Stock

1+ parts

$12.007

100+ parts

-

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2,972

$12.007

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Corohmni

South Africa . 161 parts In-Stock

1+ parts

$15.600

100+ parts

-

1k+ parts

-

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161

$15.600

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-

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Microchip USA

USA . 1,854 parts In-Stock

1+ parts

$33.820

100+ parts

$33.340

1k+ parts

$33.100

10k+ parts

$32.860

1,854

$33.820

$33.340

$33.100

$32.860

Lixinc

USA . 19,162 parts In-Stock

1+ parts

-

100+ parts

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19,162

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Perfect Parts

USA . 10,080 parts In-Stock

1+ parts

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10,080

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10,000

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A-Z Elektronik GmbH

Germany . 9,000 parts In-Stock

1+ parts

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100+ parts

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9,000

-

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UNI Independent Distributors

Spain . 5,759 parts In-Stock

1+ parts

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100+ parts

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5,759

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Argo Parts USA

USA . 1,300 parts In-Stock

1+ parts

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100+ parts

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1,300

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Overview

Unlock unparalleled connectivity and performance with the MC33908LAE by NXP Semiconductors. Crafted with precision and expertise, this network interface marvel offers seamless integration and unmatched reliability for a wide range of applications. Elevate your projects with the cutting-edge technology and innovative design of NXP Semiconductors, setting new standards in automotive connectivity. Experience the value and benefits of the MC33908LAE, delivering superior quality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to wear and tear, making the product long-lasting.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation, making it suitable for various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions, ensuring reliable performance.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and corrosion resistance, enhancing the product's overall reliability.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent industry standards for performance and reliability in automotive environments.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Network Interfaces MC33908LAE attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

MC33908LAE Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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