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MC33907NAER2

NXP Semiconductors

MC33907NAER2 by NXP Semiconductors

MC33907NAER2 by NXP Semiconductors is an automotive-grade interface circuit with 48 terminals in a square package. It operates b/w -40 to 125°C, suitable for network interfaces. The flatpack design with matte tin finish and gull wing terminals make it ideal for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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EBV Elektronik

Germany . 20,000 parts In-Stock

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Avnet

USA . 2,000 parts In-Stock

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2,000

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Digiode

USA . 4,170 parts In-Stock

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4,170

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Vyrian

USA . 610 parts In-Stock

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610

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Anansix

USA . 235 parts In-Stock

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235

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Nova Conductors

Japan . 77 parts In-Stock

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77

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AZTECH Wire

Italy . 94 parts In-Stock

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$8.208

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94

$8.208

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Aztec Data Supply Inc.

USA . 3,202 parts In-Stock

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$8.471

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$8.471

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Corohmni

South Africa . 859 parts In-Stock

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$17.269

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Microchip USA

USA . 4,303 parts In-Stock

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$18.645

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Semicontronic

India . 1,064 parts In-Stock

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$381.000

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$371.475

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$369.570

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$381.000

$371.475

$369.570

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Ampacity Inc.

Singapore . 438 parts In-Stock

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$516.000

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One Stop Electronics

USA . 1,241 parts In-Stock

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$828.000

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Perfect Parts

USA . 8,960 parts In-Stock

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UNI Independent Distributors

Spain . 7,020 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,508 parts In-Stock

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Corphita

USA . 3,448 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,941 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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Kepictronics

USA . 1,990 parts In-Stock

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Continental Prestige Electronics

USA . 1,918 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Experience cutting-edge technology with the MC33907NAER2 by NXP Semiconductors, a leader in semiconductor innovation. This network interface device offers unrivaled quality and reliability for automotive applications, ensuring seamless connectivity and optimal performance. With its advanced features and robust design, this product provides unparalleled value and benefits to customers looking for superior networking solutions. Trust NXP Semiconductors to deliver excellence in every component, empowering you to stay ahead in today's fast-paced digital world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the network interface, making it suitable for various applications.

Surface Mount: YES

Enables easy and efficient installation of the network interface on a printed circuit board, saving time and effort.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high-temperature environments, making it ideal for industrial and automotive applications.

Terminal Finish: MATTE TIN

Offers excellent conductivity and corrosion resistance for the terminals, ensuring a long-lasting and reliable connection.

Width: 7 mm

Compact form factor allows for efficient use of space on the PCB, making it suitable for designs with space constraints.

Telecom IC Type: INTERFACE CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimal performance in networking systems.

Technical Specifications

Network Interfaces MC33907NAER2 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

MC33907NAER2 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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