Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MC33907NAER2 by NXP Semiconductors is an automotive-grade interface circuit with 48 terminals in a square package. It operates b/w -40 to 125°C, suitable for network interfaces. The flatpack design with matte tin finish and gull wing terminals make it ideal for surface mount applications.
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Provides a lightweight and durable package for the network interface, making it suitable for various applications.
Enables easy and efficient installation of the network interface on a printed circuit board, saving time and effort.
Ensures reliable performance even in high-temperature environments, making it ideal for industrial and automotive applications.
Offers excellent conductivity and corrosion resistance for the terminals, ensuring a long-lasting and reliable connection.
Compact form factor allows for efficient use of space on the PCB, making it suitable for designs with space constraints.
Specifically designed for telecom applications, ensuring compatibility and optimal performance in networking systems.
Network Interfaces MC33907NAER2 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
MC33907NAER2 Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Design Chg 18/Apr/2016 33907X AND 33908X 25/May/2016
PCN Assembly/Origin - Mult Dev A/T Site 28/Apr/2021
PCN Packaging - Mult Dev Pkg Seal 15/Dec/2020 All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BAV99
Toshiba
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Baneasa S A
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
Sensitron Semiconductor
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
Diodes Incorporated
LD1117S33CTR
STMicroelectronics
STMicroelectronics LD1117S33CTR is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It operates within an input voltage range of 4.75V to 15V, making it suitable for various applications requiring stable voltage regulation in compact designs. The device features low dropout voltage of 1.3V, high temperature operation up to 125°C, and small outline package style for space-constrained PCB layouts.
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
Diotec Semiconductor Ag
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
BSS123-7-F
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
1N4148WT
Eic Semiconductor
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
KSZ9897STXC-TR
Microchip Technology
Microchip Technology's KSZ9897STXC-TR is an Ethernet transceiver with 128 terminals in a square package. Operating temperature ranges from 0 to 70°C, suitable for commercial telecom applications. Terminal finish is matte tin with gull wing form, ideal for surface mount assembly.
MCP2562FDT-H/SN
MCP2562FDT-H/SN by Microchip Tech is a CAN FD transceiver with 8 Mbps data rate, operating at -40 to 150°C. It has 8 terminals in a small outline package suitable for automotive applications. With a supply voltage of 5V and peak reflow temp of 260°C, it's ideal for network interfaces requiring high-speed communication.
SN65HVD1050D
Texas Instruments
SN65HVD1050D by Texas Instruments is a network interface IC with 8 terminals, operating at 5V. It has a data rate of 1 Mbps and is designed for automotive applications. With a temperature range from -40 to 125°C, it features gull wing terminals and small outline packaging.
KSZ8041FTL
Microchip Technology's KSZ8041FTL is a 48-terminal Ethernet transceiver with 100 Mbps data rate. Operating at 0-70°C, it has a supply voltage of 3.3V and consumes up to 58.3mA current. Ideal for network interfaces, this CMOS technology chip comes in a square-shaped thin profile package suitable for surface mounting applications.
88E3018-A2-NNC1I000
Marvell Technology
Marvell Technology's 88E3018-A2-NNC1I000 is a CMOS Ethernet transceiver with 64 terminals in a square chip carrier package. It operates in industrial temperature range (-40 to 85°C) with matte tin finish and no lead terminal form. Nominal voltage is 2.5V, making it suitable for network interfaces requiring high reliability and compact design.
VSC8541XMV-02
VSC8541XMV-02 by Microchip Tech is an Ethernet transceiver with 1000 Mbps data rate. It operates b/w 0-125°C, has 68 terminals in a square package style, and is surface mountable. Ideal for telecom applications requiring high-speed network interfaces.
TCAN334GDR
TCAN334GDR by Texas Instruments is an 8-terminal interface circuit with a data rate of 5 Mbps. Operating in automotive-grade temperature range (-40 to 125°C), it has a supply voltage of 3.3V and nickel palladium gold terminal finish. Ideal for network interfaces, this small outline package IC is surface mountable and suitable for various telecom applications.
AR8031-AL1A
Qualcomm
Qualcomm's AR8031-AL1A is an Ethernet transceiver with 1000 Mbps data rate, operating at 0-70°C. It features a square chip carrier package with 48 terminals and a low supply current of 113.7 mA. Ideal for network interfaces in commercial applications due to its compact size and surface mount capability.
MCP251863T-E/SSVAO
CAN FD TRANSCEIVER;
TJA1044GT/3Z
NXP Semiconductors
NXP Semiconductors' TJA1044GT/3Z is a CAN transceiver with 5 Mbps data rate, 8 terminals, and AEC-Q100 screening. It operates at -40 to 150°C, suitable for automotive applications due to its small outline package and high reliability.
TCAN1042VDRQ1
TCAN1042VDRQ1 by Texas Instruments is an Ethernet transceiver with 2 Mbps data rate. It operates b/w -55 to 125 °C, suitable for military-grade applications. The small outline package has 8 terminals and supports surface mount technology.
MCP2562FD-E/MF
MCP2562FD-E/MF by Microchip is a CAN FD transceiver with 8 Mbps data rate, operating at -40 to 125°C. It has 70 mA supply current, suitable for automotive applications due to TS16949 screening and small outline package style.
ADM3057EBRWZ-RL
ADM3057EBRWZ-RL by Analog Devices is a Network Interface IC with 20 terminals, operating b/w -40 to 105°C. It features Gull Wing terminals, 5V supply voltage, and small outline package style. Ideal for industrial applications requiring interface circuitry in compact spaces.
KSZ8995XA
Micrel
LAN SWITCHING CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;
MAX13054ASA-T
Maxim Integrated
MAX13054ASA-T by Maxim Integrated is a network interface with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 5V, data rate of 1Mbps, and is ideal for automotive applications requiring small outline packages.
MCP2561FD-E/P
MCP2561FD-E/P by Microchip: CAN FD transceiver for automotive apps. Data rate up to 8 Mbps, operates at -40 to 125°C. Package style: in-line, with 8 terminals and matte tin finish.
KSZ8041FTLI
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TFQFP; Package Shape: SQUARE;
KSZ9131MNXI
The Microchip Technology KSZ9131MNXI is an Ethernet transceiver with a data rate of 1000 Mbps. It operates in industrial temperature grade range from -40 to 85 °C and has a nominal voltage of 1.2 V. This network interface chip comes in a square package style with 64 terminals, suitable for surface mount applications.
KSZ8851-16MLLI-TR
Microchip Technology's KSZ8851-16MLLI-TR is an Ethernet transceiver with 48 terminals in a low profile flatpack package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features include CMOS technology, matte tin finish, and TS 16949 screening level.
DP83848MPTBEP
DP83848MPTBEP by Texas Instruments is an Ethernet transceiver with 100000 Mbps data rate. It operates at -55 to 125 °C, suitable for military-grade applications. The package is a square flatpack with 48 terminals, featuring GULL WING terminal form and 0.5 mm pitch.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MC33664ATL1EG
INTERFACE CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MC33907NAE
MC33907NAE by NXP Semiconductors is a Network Interface IC with 48 terminals, operating b/w -40 to 125°C. It features matte tin finish, quad terminal position, and gull wing form factor. Ideal for automotive applications requiring interface circuitry in compact spaces.
Freescale Semiconductor
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: HLFQFP; Package Shape: SQUARE;
MC33664ATL1EGR2
INTERFACE CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MC33907LAE
MC33907LAE by NXP Semiconductors is an automotive-grade interface circuit with 48 terminals in a square package. It operates b/w -40 to 125°C, suitable for network interfaces. The IC has a low profile, gull wing terminal form, and is surface mountable with a peak reflow temperature of 260°C.
MC33FS6503CAE
CAN FD/LIN TRANSCEIVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Screening Level: AEC-Q100; Peak Reflow Temperature (C): 260;
MC33908LAE
MC33908NAE
MC33FS4507LAER2
CAN FD/LIN TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: HLFQFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
MC33FS4507LAE
MC33FS4507LAE by NXP Semiconductors is a CAN FD/LIN transceiver with 2 transceivers. Operating temp range -40 to 125°C, it's AEC-Q100 compliant for automotive applications. Features include quad terminal position, SMARTMOS technology, and flatpack package style.
MC33662BLEFR2
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MC33907NAER2
MC33889BPEGR2
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
MC33889BPEGR2 by NXP Semiconductors is a Network Interface IC with 28 terminals, operating at -40 to 125°C. It has a supply voltage range of 5.5-18V and data rate of 0.125 Mbps, suitable for automotive applications requiring interface circuitry in compact designs.
MC33FS6523CAE
CAN FD/LIN TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
MC33907AE
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