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BFS20R-TAPE-13

NXP Semiconductors

BFS20R-TAPE-13 by NXP Semiconductors

BFS20R-TAPE-13 from NXP Semiconductors is an NPN RF BJT ideal for high-frequency applications. It features a max collector-emitter voltage of 20V, a nominal transition frequency of 450MHz, and operates up to 150 °C. This compact surface-mount transistor excels in signal amplification.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,680 parts In-Stock

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3,680

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Vyrian

USA . 3,285 parts In-Stock

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3,285

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Anansix

USA . 2,243 parts In-Stock

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2,243

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Distributors (Availability)

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One Stop Electronics

USA . 1,321 parts In-Stock

1+ parts

$33.050

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1,321

$33.050

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UNI Independent Distributors

Spain . 4,525 parts In-Stock

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4,525

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Corphita

USA . 3,935 parts In-Stock

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3,935

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Native Components

USA . 483 parts In-Stock

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$4.739

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483

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$4.739

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Northwest PG Solutions

USA . 463 parts In-Stock

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$4.788

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463

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$4.788

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Overview

Unlock the potential of your designs with the BFS20R-TAPE-13 from NXP Semiconductors. This high-quality NPN RF Small Signal BJT delivers exceptional performance in compact applications, ensuring reliability even under extreme temperatures. With its innovative surface mount technology and robust construction, it’s perfect for telecommunications, audio equipment, and consumer electronics. Trust in NXP's legacy of excellence to elevate your projects with efficiency and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides a robust and durable design, making it suitable for various environments.

Polarity or Channel Type: NPN

As an NPN transistor, it is ideal for amplifying and switching applications, which are commonly required in RF circuits.

Configuration: SINGLE

The single configuration ensures simplicity and efficiency in circuit design, reducing potential failure points.

Surface Mount: YES

The surface mount design allows for compact layouts and high-density packaging, increasing application performance.

Package Shape: RECTANGULAR

The rectangular package shape is standard and versatile, enabling easy integration into various circuit designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and mechanical stability, ensuring reliable connections.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

This feature enables the transistor to operate efficiently in high-frequency applications, making it suitable for RF systems.

No. of Terminals: 3

With three terminals, this transistor offers a simple configuration for ease of use while maintaining performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style maximizes space efficiency, enabling its use in compact electronic devices.

Minimum DC Current Gain (hFE): 40

A minimum DC current gain of 40 ensures adequate amplification, making this transistor effective in various applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance makes it reliable in demanding environments and thermal conditions.

Maximum Collector-Emitter Voltage: 20 V

A collector-emitter voltage of 20V provides flexibility for use in a range of circuits without risk of breakdown.

Transistor Element Material: SILICON

Silicon as the semiconductor material offers excellent performance and reliability, making it a popular choice for BJTs.

Maximum Collector Current (IC): 0.025 A

The maximum collector current of 25mA is adequate for driving many RF circuit applications without significant heat issues.

Terminal Position: DUAL

Dual terminal position facilitates versatile connection options, enhancing circuit design flexibility.

Nominal Transition Frequency (fT): 450 MHz

A transition frequency of 450 MHz allows for high-speed switching and amplification in RF applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFS20R-TAPE-13 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Minimum DC Current Gain (hFE):

40

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFS20R-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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