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BFP840FESDH6327XTSA1

Infineon Technologies

BFP840FESDH6327XTSA1 by Infineon Technologies

BFP840FESDH6327XTSA1 by Infineon Technologies is a NPN RF BJT transistor with max. collector-emitter voltage of 2.25V and max. collector current of 0.035A, ideal for amplifier applications in KA band frequencies up to 85GHz. This surface-mount transistor has a small outline package with 4 terminals and uses silicon germanium carbon as the element material.

Median Price

$0.350

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 39 parts In-Stock

1+ parts

$0.347

100+ parts

$0.206

1k+ parts

-

10k+ parts

-

39

$0.347

$0.206

-

-

Newark

USA . 2 parts In-Stock

1+ parts

$0.693

100+ parts

$0.435

1k+ parts

-

10k+ parts

-

2

$0.693

$0.435

-

-

DigiKey

USA . 81,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.285

81,000

-

-

-

$0.285

Rochester

USA . 38,278 parts In-Stock

1+ parts

-

100+ parts

$0.195

1k+ parts

$0.162

10k+ parts

$0.144

38,278

-

$0.195

$0.162

$0.144

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.354

3,000

-

-

-

$0.354

RS (Exports)

UK . 260 parts In-Stock

1+ parts

-

100+ parts

$0.453

1k+ parts

$0.349

10k+ parts

-

260

-

$0.453

$0.349

-

Chip1Stop

Japan . 30 parts In-Stock

1+ parts

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-

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30

-

-

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Farnell

UK . 2 parts In-Stock

1+ parts

-

100+ parts

$0.231

1k+ parts

$0.152

10k+ parts

$0.149

2

-

$0.231

$0.152

$0.149

Element14

Singapore . 2 parts In-Stock

1+ parts

-

100+ parts

$0.432

1k+ parts

$0.279

10k+ parts

$0.274

2

-

$0.432

$0.279

$0.274

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 585 parts In-Stock

1+ parts

$0.152

100+ parts

-

1k+ parts

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585

$0.152

-

-

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Nova Conductors

Japan . 90 parts In-Stock

1+ parts

$0.212

100+ parts

-

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90

$0.212

-

-

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Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

$0.637

100+ parts

$0.236

1k+ parts

$0.166

10k+ parts

-

3,000

$0.637

$0.236

$0.166

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Vyrian

USA . 8,768 parts In-Stock

1+ parts

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100+ parts

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8,768

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Chip Stock

USA . 7,200 parts In-Stock

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7,200

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NAC Semi

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.342

3,000

-

-

-

$0.342

ComSIT Distribution GmbH

Germany . 1,217 parts In-Stock

1+ parts

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1,217

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VNN

France . 90 parts In-Stock

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90

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Cogito LLC

Ukraine . 61 parts In-Stock

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61

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,025 parts In-Stock

1+ parts

$0.136

100+ parts

-

1k+ parts

-

10k+ parts

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9,025

$0.136

-

-

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Semicontronic

India . 8,646 parts In-Stock

1+ parts

$0.136

100+ parts

$0.133

1k+ parts

$0.132

10k+ parts

-

8,646

$0.136

$0.133

$0.132

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Corphita

USA . 312 parts In-Stock

1+ parts

$0.144

100+ parts

-

1k+ parts

-

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312

$0.144

-

-

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$0.212

100+ parts

$0.201

1k+ parts

$0.191

10k+ parts

$0.189

450

$0.212

$0.201

$0.191

$0.189

Argo Parts USA

USA . 1,137 parts In-Stock

1+ parts

$0.212

100+ parts

-

1k+ parts

-

10k+ parts

$0.206

1,137

$0.212

-

-

$0.206

Component Stockers USA

USA . 18,505 parts In-Stock

1+ parts

$0.250

100+ parts

$0.180

1k+ parts

$0.140

10k+ parts

$0.140

18,505

$0.250

$0.180

$0.140

$0.140

Continental Prestige Electronics

USA . 212 parts In-Stock

1+ parts

$0.502

100+ parts

$0.265

1k+ parts

$0.177

10k+ parts

$0.150

212

$0.502

$0.265

$0.177

$0.150

Corohmni

South Africa . 1,075 parts In-Stock

1+ parts

$1.558

100+ parts

-

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1,075

$1.558

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Aztec Data Supply Inc.

USA . 1,540 parts In-Stock

1+ parts

$1.570

100+ parts

-

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1,540

$1.570

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Modulus Dynamics

Lithuania . 9,819 parts In-Stock

1+ parts

$1.951

100+ parts

$1.873

1k+ parts

$1.795

10k+ parts

-

9,819

$1.951

$1.873

$1.795

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$2.097

100+ parts

$2.076

1k+ parts

$1.992

10k+ parts

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2,000

$2.097

$2.076

$1.992

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Perfect Parts

USA . 25,915 parts In-Stock

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25,915

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S.R.D Solutions

India . 11,990 parts In-Stock

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11,990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Robosynatics

Brazil . 300 parts In-Stock

1+ parts

-

100+ parts

$0.271

1k+ parts

$0.271

10k+ parts

$0.271

300

-

$0.271

$0.271

$0.271

Lucentia Tech

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$0.271

1k+ parts

$0.271

10k+ parts

$0.271

300

-

$0.271

$0.271

$0.271

Overview

Elevate your RF signal amplification with the BFP840FESDH6327XTSA1 by Infineon Technologies. Crafted with precision and expertise, this NPN transistor offers unparalleled performance in the KA band, making it ideal for a wide range of amplifier applications. With its small outline package and dual terminal position, this transistor provides ease of installation and maximum flexibility. Trust in Infineon Technologies to deliver superior quality and reliability, ensuring that your RF systems operate at their peak efficiency. Experience the difference with the BFP840FESDH6327XTSA1 - where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and resilience are important factors.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification, making this product suitable for amplifier applications.

Configuration: SINGLE

Single configurations are simpler and easier to work with, making this product user-friendly for amplifier circuit designs.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplifying signals.

Surface Mount: YES

Surface mount capability allows for easy and compact PCB layout, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of board space and facilitates easy placement on PCBs.

Terminal Form: FLAT

Flat terminals make soldering easier and ensure a secure connection for reliable performance.

Highest Frequency Band: KA BAND

Operating in the KA band frequency range, this product is suitable for high-frequency applications where fast signals need to be processed.

No. of Terminals: 4

Having 4 terminals allows for more flexible circuit configurations and connections, enhancing the versatility of the product.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on PCBs and enables compact designs, especially important for portable or space-constrained applications.

Maximum Collector-Emitter Voltage: 2.25 V

With a high maximum collector-emitter voltage, this product can handle larger input voltages without breakdown, ensuring robustness in varying operating conditions.

Transistor Element Material: SILICON GERMANIUM CARBON

The use of silicon germanium carbon material offers high performance and efficiency, making this product a reliable choice for demanding applications.

Maximum Collector Current (IC): 0.035 A

With a maximum collector current of 0.035 A, this product can handle moderate current levels, suitable for various amplifier applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection over time.

Terminal Position: DUAL

Having dual terminal positions allows for flexible mounting options and easy integration into different circuit layouts.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standards ensures high reliability and quality, making this product suitable for automotive and other demanding environments.

Nominal Transition Frequency (fT): 85000 MHz

With a high nominal transition frequency of 85 GHz, this product offers excellent amplification capabilities for high-frequency signals, making it ideal for RF applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFP840FESDH6327XTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

2.25 V

Configuration:

Highest Frequency Band:

KA BAND

JESD-30 Code:

R-PDSO-F4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON GERMANIUM CARBON

Nominal Transition Frequency (fT):

Trade Compliance

BFP840FESDH6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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