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BFR31

NXP Semiconductors

BFR31 by NXP Semiconductors

The NXP Semiconductors BFR31 is a small signal FET with N-CHANNEL polarity, suitable for amplifier applications. It features a 25V DS breakdown voltage, 0.3W power dissipation, and 1.5pF feedback capacitance. With a max operating temperature of 150°C, it comes in a rectangular package with GULL WING terminals for surface mount assembly.

Median Price

$1.450

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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NAC Semi

USA . 861 parts In-Stock

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$1.450

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ABC Electronics Ltd.

UK . 4,530 parts In-Stock

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Digiode

USA . 3,819 parts In-Stock

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Anansix

USA . 3,138 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

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ECAB

Sweden . 1,600 parts In-Stock

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ICP Electronique

France . 880 parts In-Stock

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ComSIT Distribution GmbH

Germany . 791 parts In-Stock

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Sunrise Surplus Inc.

USA . 763 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Vyrian

USA . 141 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 30 parts In-Stock

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Elcom Components

USA . 17 parts In-Stock

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Corohmni

South Africa . 925 parts In-Stock

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$1.025

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925

$1.025

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IDEA Electronic Components Group

UK . 120 parts In-Stock

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$1.719

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$1.547

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$1.719

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Aztec Data Supply Inc.

USA . 2,019 parts In-Stock

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$1.880

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MKK Technologies

India . 2,009 parts In-Stock

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$3.232

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DigiPath Technology Company

USA . 2,009 parts In-Stock

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$3.232

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AZTECH Wire

Italy . 436 parts In-Stock

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$17.571

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Ampacity Inc.

Singapore . 606 parts In-Stock

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$22.050

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One Stop Electronics

USA . 1,117 parts In-Stock

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Lixinc

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Kepictronics

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Continental Prestige Electronics

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A-Z Elektronik GmbH

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Corphita

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Perfect Parts

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Alle Elektronik GmbH

Germany . 3,587 parts In-Stock

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UNI Independent Distributors

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Parana Technologies

USA . 990 parts In-Stock

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Argo Parts USA

USA . 549 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Assy Fe

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Overview

Elevate your amplifier projects with the BFR31 by NXP Semiconductors. Crafted with precision and expertise, this Small Signal Field Effect Transistor offers unparalleled quality and performance. With its N-CHANNEL configuration and DEPLETION MODE operating mode, the BFR31 is designed to amplify signals effortlessly. Whether you're a seasoned professional or a DIY enthusiast, this transistor's ease of use and reliability will take your projects to the next level. Experience the difference with the BFR31 - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for efficient flow of electrical current in one direction, enhancing performance.

Configuration: SINGLE

Simplified design with single configuration for easy installation and maintenance.

Transistor Application: AMPLIFIER

Optimized for amplification tasks, ensuring high-quality sound output.

Surface Mount: YES

Easily mountable on circuit boards, saving space and facilitating automated assembly.

Minimum DS Breakdown Voltage: 25 V

Withstands high voltage levels, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

Compact shape for efficient use of space on circuit boards.

Terminal Form: GULL WING

Facilitates secure soldering and connection to the circuit board.

Operating Mode: DEPLETION MODE

Provides control over the flow of current, enabling precise operation.

No. of Terminals: 3

Simplified connection structure with fewer terminals for ease of use.

Maximum Power Dissipation (Abs): 0.3 W

Efficiently manages power for optimal performance without overheating.

Package Style (Meter): SMALL OUTLINE

Compact design for space-saving installation in electronic devices.

Field Effect Transistor Technology: JUNCTION

Utilizes junction technology for enhanced performance and reliability.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, ideal for use in various environments.

Transistor Element Material: SILICON

Silicon material ensures stability and efficiency in operation.

Terminal Finish: Tin (Sn)

Tin finish offers corrosion resistance and facilitates soldering.

Maximum Drain Current (ID): 0.01 A

Handles current flow effectively, ensuring reliable performance.

Terminal Position: DUAL

Dual terminal position for versatile connectivity options.

Maximum Time At Peak Reflow Temperature (s): 30

Can sustain peak reflow temperature for required duration during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for efficient assembly processes.

Maximum Feedback Capacitance (Crss): 1.5 pF

Low feedback capacitance ensures minimal signal distortion and interference.

Technical Specifications

Small Signal Field Effect Transistors (FET) BFR31 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

.01 A

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

1.5 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BFR31 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00

NSN

5961-01-422-2429, 5961014222429

NIIN

014222429

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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