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BFR31LT1

Onsemi

BFR31LT1 by Onsemi

BFR31LT1 by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, ideal for AMPLIFIER applications. It features DEPLETION MODE operation, GULL WING terminals, and 1.5pF Crss feedback capacitance. With a max power dissipation of 0.3W and operating temperature up to 150°C, it is suitable for small outline surface mount designs.

Median Price

$0.150

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Chip Stock

USA . 42,000 parts In-Stock

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France . 3,380 parts In-Stock

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Pegasus Components GmbH

Germany . 2,992 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 1,671 parts In-Stock

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Digiode

USA . 978 parts In-Stock

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Component Sense

UK . 714 parts In-Stock

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Vyrian

USA . 285 parts In-Stock

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LittleDiode

UK . 127 parts In-Stock

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Nova Conductors

Japan . 61 parts In-Stock

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Corohmni

South Africa . 121 parts In-Stock

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$0.150

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Aztec Data Supply Inc.

USA . 105 parts In-Stock

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$1.720

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$2.203

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$2.005

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$1.806

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AZTECH Wire

Italy . 285 parts In-Stock

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$6.359

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Ampacity Inc.

Singapore . 551 parts In-Stock

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$35.050

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QUARKTWIN TECHNOLOGY LTD

USA . 13,116 parts In-Stock

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SupplyDigital Components

Austria . 8,142 parts In-Stock

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TANS Electronics

Latvia . 6,018 parts In-Stock

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Problanco Electronics

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Corphita

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Kulean Microsystems

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Continental Prestige Electronics

USA . 768 parts In-Stock

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UHIMA Technologies

Türkiye . 471 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Argo Parts USA

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Experience superior performance and reliability with the BFR31LT1 by Onsemi, a leading manufacturer in the industry. This small signal field effect transistor (FET) is perfect for a wide range of applications, from amplifiers to other electronic devices. With its high-quality construction and advanced technology, this product offers unmatched value and benefits to our customers. Upgrade your projects with the BFR31LT1 and enjoy top-notch performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, making it suitable for various applications and environments.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors typically have lower ON resistance and better performance, which is advantageous for amplifier applications.

Configuration: SINGLE

Single configuration simplifies circuit design and reduces complexity, making it easier to use in amplifier circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and efficiency in signal amplification.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this transistor can handle higher voltages without breakdown, ensuring reliability in operation.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact form factor, making it suitable for applications where space is limited.

Terminal Form: GULL WING

Gull wing terminals offer easy soldering and reliable connections, enhancing the overall durability and longevity of the transistor.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for easy biasing and control, making this transistor suitable for a wide range of amplifier circuits.

Maximum Power Dissipation (Abs): 0.3 W

With a maximum power dissipation of 0.3W, this transistor can handle moderate power levels, ensuring efficient operation in amplifier circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enables compact circuit designs, ideal for applications with size constraints.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high performance and reliability, making this transistor a suitable choice for amplifier applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand elevated temperatures, ensuring stability and longevity in operation.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material, providing good electrical properties and performance for amplifier circuits.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish offers good solderability and conductivity, ensuring reliable connections and preventing corrosion over time.

Terminal Position: DUAL

Dual terminal position allows for flexible connection options, making it easier to integrate this transistor into different circuit configurations.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this transistor can withstand soldering processes without degradation.

Peak Reflow Temperature °C: 235

Peak reflow temperature of 235°C ensures proper soldering and reliability during assembly processes, maintaining the integrity of the transistor.

Maximum Feedback Capacitance (Crss): 1.5 pF

Low feedback capacitance of 1.5pF reduces signal distortion and improves high-frequency performance in amplifier circuits.

Technical Specifications

Small Signal Field Effect Transistors (FET) BFR31LT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

1.5 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BFR31LT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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