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BFR31LT3

Onsemi

BFR31LT3 by Onsemi

BFR31LT3 by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, ideal for AMPLIFIER applications. It features GULL WING terminals, operates in DEPLETION MODE, and has a max operating temperature of 150 °C. This SMALL OUTLINE transistor has a feedback capacitance of 1.5 pF and is suitable for surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,388 parts In-Stock

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Vyrian

USA . 2,092 parts In-Stock

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2,092

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Native Components

USA . 8 parts In-Stock

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$0.217

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$0.208

8

$0.217

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$0.208

Northwest PG Solutions

USA . 1,678 parts In-Stock

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$0.239

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$0.210

1,678

$0.239

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$0.210

SupplyDigital Components

Austria . 6,582 parts In-Stock

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Kulean Microsystems

USA . 5,009 parts In-Stock

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5,009

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Problanco Electronics

Mexico . 3,492 parts In-Stock

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Corphita

USA . 1,259 parts In-Stock

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UHIMA Technologies

Türkiye . 574 parts In-Stock

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TANS Electronics

Latvia . 485 parts In-Stock

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Corohmni

South Africa . 299 parts In-Stock

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Overview

Enhance your electronic projects with the BFR31LT3 by Onsemi, a top-quality N-CHANNEL FET that delivers superior performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this transistor is perfect for amplifier applications. With its small outline package and GULL WING terminals, it's easy to install and use. Experience the benefits of high breakdown voltage, low feedback capacitance, and excellent temperature resistance. Trust Onsemi to provide you with the best components for your next project. Upgrade to the BFR31LT3 and take your electronics to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable, lightweight, and cost-effective, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency compared to P-channel FETs, making them a good choice for amplifier applications.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces the overall complexity of the amplifier.

Transistor Application: AMPLIFIER

Specifically designed for amplification tasks, ensuring optimal performance in signal processing applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on printed circuit boards.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this transistor can withstand higher voltages without breakdown, providing added protection to the circuit.

Package Shape: RECTANGULAR

A rectangular shape is standardized and ensures compatibility with various mounting configurations.

Terminal Form: GULL WING

Gull-wing terminals are easy to solder and provide mechanical strength to the connection, enhancing the reliability of the transistor.

Operating Mode: DEPLETION MODE

Depletion mode FETs have a normally-on characteristic, making them suitable for amplifier circuits that require an 'always-on' state for certain applications.

No. of Terminals: 3

Having 3 terminals allows for easy connectivity and compatibility with standard circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline packages save space on the circuit board and are suitable for compact designs in amplifiers and other applications.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers excellent high-frequency performance and low noise, making it ideal for amplifier applications where signal integrity is crucial.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high-temperature environments without compromising performance.

Transistor Element Material: SILICON

Silicon is a widely-used semiconductor material known for its reliability and efficiency, making it a preferred choice for transistor manufacturing.

Terminal Finish: TIN LEAD

Tin-lead terminals provide good solderability and conductivity for reliable electrical connections.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in circuit layout and connection options.

Maximum Feedback Capacitance (Crss): 1.5 pF

With a low feedback capacitance of 1.5 pF, this transistor minimizes signal distortion and ensures stable performance in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BFR31LT3 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

1.5 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BFR31LT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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