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BFR31LT1G

Onsemi

BFR31LT1G by Onsemi

BFR31LT1G by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, ideal for AMPLIFIER applications. It features GULL WING terminals, operates in DEPLETION MODE, and has a max power dissipation of 0.3W. This SMALL OUTLINE transistor has a peak reflow temperature of 260°C and feedback capacitance of 1.5pF.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

USA . 41,000 parts In-Stock

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Vyrian

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VNN

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Digiode

USA . 724 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,930 parts In-Stock

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$0.500

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AZTECH Wire

Italy . 430 parts In-Stock

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$9.362

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Ampacity Inc.

Singapore . 355 parts In-Stock

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$44.050

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QUARKTWIN TECHNOLOGY LTD

USA . 26,423 parts In-Stock

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Problanco Electronics

Mexico . 4,871 parts In-Stock

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Continental Prestige Electronics

USA . 2,453 parts In-Stock

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Kulean Microsystems

USA . 1,463 parts In-Stock

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TANS Electronics

Latvia . 1,373 parts In-Stock

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Argo Parts USA

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SupplyDigital Components

Austria . 477 parts In-Stock

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UHIMA Technologies

Türkiye . 441 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Corohmni

South Africa . 150 parts In-Stock

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Overview

Experience superior performance and reliability with the BFR31LT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality small signal FETs that are perfect for amplifier applications. With its N-channel configuration and depletion mode operation, this transistor offers exceptional value and benefits to customers. Trust in Onsemi's expertise and innovation to provide you with top-notch electronic components that meet your needs. Elevate your projects with the BFR31LT1G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors usually have higher electron mobility and faster switching speeds compared to P-Channel transistors, making them ideal for amplifiers.

Configuration: SINGLE

Simplifies circuit design and integration, making it easier to use in amplifier applications.

Transistor Application: AMPLIFIER

Specifically designed for amplification purposes, ensuring optimal performance in audio or signal amplification circuits.

Surface Mount: YES

Allows for easy and space-efficient mounting on PCBs, ideal for compact designs.

Minimum DS Breakdown Voltage: 25 V

With a breakdown voltage of 25V, this transistor can handle higher voltage levels without failing, making it reliable for amplifier applications.

Maximum Power Dissipation (Abs): 0.3 W

With a maximum power dissipation of 0.3W, this transistor can handle moderate power levels without overheating.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures, ensuring stability and performance under various operating conditions.

Maximum Feedback Capacitance (Crss): 1.5 pF

Low feedback capacitance helps in reducing signal distortion and improving overall amplifier performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) BFR31LT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

1.5 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BFR31LT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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