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BFR30LT1

Onsemi

BFR30LT1 by Onsemi

BFR30LT1 by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, ideal for AMPLIFIER applications. It features GULL WING terminals, operates in DEPLETION MODE, and has a max power dissipation of 0.3W. This SMALL OUTLINE transistor has a peak reflow temperature of 235 °C and feedback capacitance of 1.5pF.

Median Price

$0.335

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 1,957 parts In-Stock

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$0.290

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$0.290

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Component Electronics Inc.

Canada . 500 parts In-Stock

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$0.380

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$0.290

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$0.250

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500

$0.380

$0.290

$0.250

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Chip Stock

USA . 68,000 parts In-Stock

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Pegasus Components GmbH

Germany . 9,000 parts In-Stock

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Goldney Electronics S.L.

Spain . 3,000 parts In-Stock

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J2 Sourcing AB

Sweden . 2,700 parts In-Stock

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2,700

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ComSIT Distribution GmbH

Germany . 1,200 parts In-Stock

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Digiode

USA . 756 parts In-Stock

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Vyrian

USA . 291 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 477 parts In-Stock

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$0.290

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477

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Kulean Microsystems

USA . 6,953 parts In-Stock

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SupplyDigital Components

Austria . 5,709 parts In-Stock

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Assy Fe

Spain . 5,500 parts In-Stock

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Problanco Electronics

Mexico . 3,065 parts In-Stock

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Corphita

USA . 2,251 parts In-Stock

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TANS Electronics

Latvia . 973 parts In-Stock

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UHIMA Technologies

Türkiye . 581 parts In-Stock

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Native Components

USA . 243 parts In-Stock

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Northwest PG Solutions

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Overview

Unleash the power of innovation with the BFR30LT1 by Onsemi - a cutting-edge Small Signal Field Effect Transistor that guarantees top-notch quality and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL transistor is perfect for applications in amplifiers, offering unparalleled performance and efficiency. With its sleek design and advanced technology, the BFR30LT1 ensures optimal power dissipation and temperature resistance, making it the ideal choice for all your electronic needs. Trust Onsemi to deliver excellence with every product, and experience the difference with the BFR30LT1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, making it suitable for long-term use in various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are commonly used for high performance applications due to their faster electron mobility and lower resistance compared to P-Channel FETs.

Configuration: SINGLE

Simplifies circuit design and makes it easier to integrate into electronic systems without the need for complex configurations.

Transistor Application: AMPLIFIER

Ideal for amplifying signals in various electronic devices such as audio amplifiers, providing clear and strong signal output.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and enabling mass production of electronic devices.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this FET can handle higher voltage loads and provide reliable performance in demanding applications.

Maximum Power Dissipation (Abs): 0.3 W

Efficiently dissipates heat generated during operation, ensuring stable performance and preventing overheating issues.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures without compromising performance, suitable for industrial and automotive applications.

Maximum Feedback Capacitance (Crss): 1.5 pF

Low feedback capacitance helps in reducing signal distortion and improving overall signal integrity in amplifier circuits.

Technical Specifications

Small Signal Field Effect Transistors (FET) BFR30LT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

1.5 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BFR30LT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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