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BF904-TAPE-13

NXP Semiconductors

BF904-TAPE-13 by NXP Semiconductors

BF904-TAPE-13 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a max DS breakdown voltage of 7V, operates in the ultra-high frequency band, and supports dual gate enhancement mode. This compact surface mount device ensures efficient performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,486 parts In-Stock

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Anansix

USA . 2,218 parts In-Stock

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Vyrian

USA . 1,274 parts In-Stock

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One Stop Electronics

USA . 1,129 parts In-Stock

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$22.050

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Corphita

USA . 4,027 parts In-Stock

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UNI Independent Distributors

Spain . 2,920 parts In-Stock

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Native Components

USA . 578 parts In-Stock

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Northwest PG Solutions

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Overview

Unlock unparalleled performance with the BF904-TAPE-13 from NXP Semiconductors, a trusted leader in innovation. Designed for RF small signal applications, this robust N-channel FET excels as an amplifier, ensuring superior signal integrity even in challenging environments. Its compact surface-mount design and built-in diode offer seamless integration and reliability, making it ideal for cutting-edge devices. Elevate your projects with quality you can depend on—choose NXP for unmatched value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and protects the internal components, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency, making this transistor ideal for amplification and switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and functionality, making it versatile for various circuit designs.

Transistor Application: AMPLIFIER

Designed for amplification, this FET excels in low-noise applications, enhancing overall signal integrity.

Surface Mount: YES

Surface mount technology minimizes space requirements on PCBs, allowing for compact and efficient designs.

Minimum DS Breakdown Voltage: 7 V

With a minimum breakdown voltage of 7V, this product ensures reliable operation in low voltage applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout on PCBs, facilitating better thermal management and space efficiency.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering properties, ensuring a secure connection on PCBs.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

The dual gate configuration allows for greater control over the device, making it suitable for RF applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band makes this FET suitable for high-speed applications and communications.

No. of Terminals: 4

Having four terminals allows for versatile circuit designs and efficient connections in compact applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space along with easy handling and installation in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and low power consumption, enhancing overall efficiency.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this product is suitable for high-temperature environments.

Transistor Element Material: SILICON

Silicon is a widely used material known for its excellent electrical properties, ensuring reliable performance.

Maximum Drain Current (ID): 0.03 A

The maximum drain current of 0.03 A makes this FET suitable for low-power applications without compromising performance.

Terminal Position: DUAL

Dual terminal positioning enhances connection versatility, facilitating better circuit management.

Case Connection: SOURCE

Having the source connection optimizes ease of integration into various circuit configurations.

Maximum Feedback Capacitance (Crss): 0.035 pF

Low feedback capacitance ensures minimal signal distortion and enhances frequency response in high-frequency applications.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF904-TAPE-13 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

7 V

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.035 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF904-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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