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BF991-TAPE-7

NXP Semiconductors

BF991-TAPE-7 by NXP Semiconductors

BF991-TAPE-7 by NXP Semiconductors is an N-channel RF FET designed for amplifier applications. It features a dual gate, depletion mode operation with a max drain current of 20 mA and a breakdown voltage of 20 V. This compact surface mount device operates in the very high frequency band, ideal for advanced RF circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,691 parts In-Stock

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4,691

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Anansix

USA . 1,741 parts In-Stock

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Digiode

USA . 488 parts In-Stock

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488

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Native Components

USA . 129 parts In-Stock

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$1.351

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129

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Northwest PG Solutions

USA . 138 parts In-Stock

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$1.486

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138

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One Stop Electronics

USA . 862 parts In-Stock

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$54.050

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862

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UNI Independent Distributors

Spain . 4,351 parts In-Stock

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Corphita

USA . 2,197 parts In-Stock

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Overview

Elevate your designs with the BF991-TAPE-7 from NXP Semiconductors, a leader in innovation and quality. This exceptional RF small signal FET delivers superior performance for amplification applications, boasting remarkable reliability in very high-frequency ranges. Its compact surface mount design ensures easy integration and optimal thermal management. Trust in NXP's expertise to enhance your projects with cutting-edge technology, delivering unparalleled value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body provides durability and protection against environmental factors, making this FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better electron mobility, resulting in higher efficiency and performance for amplifier applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added protection and simplifies circuit design, enhancing reliability in high-frequency applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal processing and enhancing overall audio quality.

Surface Mount: YES

Surface mount technology allows for compact designs and higher integration on PCBs, reducing space and improving electrical performance.

Minimum DS Breakdown Voltage: 20 V

The 20 V minimum breakdown voltage ensures robustness and usability in various signal amplification circuits without breakdown risk.

Package Shape: RECTANGULAR

The rectangular shape aids in better PCB layout and more efficient utilization of board space.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve mechanical strength for reliable connections.

Operating Mode: DUAL GATE, DEPLETION MODE

The dual gate design allows for better control of the signal amplification, enhancing linearity and reducing distortion.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Suitable for very high-frequency applications, making it an excellent choice for RF designs and communication systems.

No. of Terminals: 4

The 4-terminal configuration allows for sufficient connectivity while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables high-density applications, ideal for space-constrained electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides improved switching speeds and power efficiency, making it suitable for modern electronic applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for reliable performance in harsh conditions, improving longevity.

Transistor Element Material: SILICON

Silicon is a well-established semiconductor material, ensuring stability and performance across a wide range of temperatures.

Maximum Drain Current (ID): 0.02 A

A maximum drain current of 0.02 A indicates versatility in low to moderate power applications, ensuring efficient signal processing.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility in circuit designs, facilitating optimal performance in various configurations.

Case Connection: SOURCE

With source as the case connection, the design offers simpler integration into circuit layouts for streamlined performance.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF991-TAPE-7 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.02 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF991-TAPE-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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