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BBY39TRL13

NXP Semiconductors

BBY39TRL13 by NXP Semiconductors

BBY39TRL13 by NXP Semiconductors is a surface-mount varactor diode featuring a dual terminal design and a min capacitance ratio of 8. Its compact rectangular package makes it ideal for RF tuning applications. This silicon-based component ensures reliable performance in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,175 parts In-Stock

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4,175

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Digiode

USA . 2,395 parts In-Stock

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2,395

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Anansix

USA . 470 parts In-Stock

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470

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Distributors (Availability)

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Native Components

USA . 500 parts In-Stock

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$0.688

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500

$0.688

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Northwest PG Solutions

USA . 1,340 parts In-Stock

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$0.757

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1,340

$0.757

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One Stop Electronics

USA . 1,036 parts In-Stock

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$2.010

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1,036

$2.010

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UNI Independent Distributors

Spain . 1,184 parts In-Stock

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Corphita

USA . 217 parts In-Stock

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Overview

Unlock a world of possibilities with the BBY39TRL13 Varactor Diode from NXP Semiconductors—a leader in innovation and quality. This compact, surface-mount diode delivers superior performance for tuning and frequency modulation applications, ensuring reliability in your designs. Experience enhanced efficiency and precision, empowering your projects to reach new heights while benefiting from NXP’s trusted expertise and commitment to excellence. Elevate your technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durable protection for the diode, ensuring reliability in various electronic applications.

Config: COMMON CATHODE, 2 ELEMENTS

The common cathode configuration allows for easier integration into circuit designs, making it versatile for multiple applications.

Surface Mount: YES

Surface mount capability enables efficient use of space on printed circuit boards (PCBs), leading to compact device designs.

Package Shape: RECTANGULAR

The rectangular package shape simplifies layout and assembly in electronic circuits, providing a more organized approach to design.

No. of Terminals: 3

Having three terminals allows for greater flexibility in circuit connections, accommodating various configurations and requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space consumption on PCBs and is ideal for high-density applications.

Terminal Position: DUAL

The dual terminal position enhances the diode's connection stability and allows easier soldering during assembly.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, it is well-suited for RF tuning applications, providing flexibility in electronic tuning setups.

Terminal Form: GULL WING

Gull wing terminals facilitate automated assembly and ensure strong mechanical connection to PCBs, enhancing reliability.

No. of Elements: 2

Having two elements allows for better performance in frequency modulation applications, giving designers more options in circuit design.

Diode Element Material: SILICON

Silicon as a diode element material ensures good performance characteristics, such as low leakage current and high breakdown voltage.

Minimum Diode Capacitance Ratio: 8

A minimum capacitance ratio of 8 indicates a wide tunability range, making it an excellent choice for applications requiring variable capacitance.

Technical Specifications

Varactor Diodes BBY39TRL13 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Config:

COMMON CATHODE, 2 ELEMENTS

Minimum Diode Capacitance Ratio:

8

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G3

No. of Elements:

2

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

Trade Compliance

BBY39TRL13 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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