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BBY39TRL

NXP Semiconductors

BBY39TRL by NXP Semiconductors

BBY39TRL by NXP Semiconductors is a surface-mount varactor diode featuring a dual-element configuration with a min capacitance ratio of 8. It comes in a small outline package made of plastic/epoxy, ideal for RF tuning applications. This silicon-based diode offers reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,601 parts In-Stock

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3,601

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Anansix

USA . 2,485 parts In-Stock

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2,485

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Vyrian

USA . 40 parts In-Stock

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40

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One Stop Electronics

USA . 427 parts In-Stock

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$1.010

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427

$1.010

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Native Components

USA . 169 parts In-Stock

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$1.350

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169

$1.350

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Northwest PG Solutions

USA . 1,842 parts In-Stock

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$1.486

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$1.486

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Corphita

USA . 2,693 parts In-Stock

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2,693

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UNI Independent Distributors

Spain . 252 parts In-Stock

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Overview

Unlock the potential of your RF designs with the BBY39TRL from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a versatile varactor diode that enhances signal tuning and stability in various applications, from communication systems to consumer electronics. With a compact design and reliable performance, the BBY39TRL ensures efficient operation while maximizing space on your circuit board, offering unmatched value and adaptability to meet your engineering needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making this varactor diode suitable for reliable long-term performance.

Config: COMMON CATHODE, 2 ELEMENTS

The common cathode configuration with two elements allows versatile circuit design and ease of integration into various applications.

Surface Mount: YES

Being a surface mount component simplifies the soldering process and enables compact PCB layouts, contributing to space-saving designs.

Package Shape: RECTANGULAR

The rectangular package shape maximizes surface area for better performance and thermal dissipation while simplifying placement on PCBs.

No. of Terminals: 3

With three terminals, this varactor diode offers straightforward connections for ease of integration into existing circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for applications where space is critical, providing flexibility in various electronic designs.

Terminal Position: DUAL

Dual terminal positioning facilitates easy connection and enhances the overall layout possibilities on PCBs.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, it is particularly useful for tuning and frequency modulation in RF applications, making it a valuable component in communication devices.

Terminal Form: GULL WING

The gull wing terminal form offers excellent mechanical strength and ensures reliable solder joints, enhancing overall product durability.

No. of Elements: 2

Having two elements allows this diode to handle distinct functions or frequencies simultaneously, expanding its versatility in application.

Diode Element Material: SILICON

Silicon as the diode element material provides excellent electronic properties, balancing performance across a wide frequency range.

Minimum Diode Capacitance Ratio: 8

A minimum capacitance ratio of 8 signifies wide tuning capability, making it exceptionally suited for applications requiring variable capacitance adjustments.

Technical Specifications

Varactor Diodes BBY39TRL attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Config:

COMMON CATHODE, 2 ELEMENTS

Minimum Diode Capacitance Ratio:

8

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G3

No. of Elements:

2

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

Trade Compliance

BBY39TRL Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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