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BBY31TRL13

NXP Semiconductors

BBY31TRL13 by NXP Semiconductors

BBY31TRL13 by NXP Semiconductors is a variable capacitance diode designed for ultra-high frequency applications. It features a 3-terminal gull-wing configuration in a small rectangular package, made of plastic/epoxy. Ideal for RF tuning and voltage-controlled oscillators, it ensures efficient performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,542 parts In-Stock

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Anansix

USA . 2,890 parts In-Stock

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2,890

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Vyrian

USA . 156 parts In-Stock

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156

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One Stop Electronics

USA . 1,227 parts In-Stock

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$3.010

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$3.010

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UNI Independent Distributors

Spain . 1,593 parts In-Stock

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Corphita

USA . 1,494 parts In-Stock

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Northwest PG Solutions

USA . 1,104 parts In-Stock

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Native Components

USA . 364 parts In-Stock

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364

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Overview

Unlock unparalleled performance with the BBY31TRL13 from NXP Semiconductors, a leader in innovative solutions. This ultra-high frequency varactor diode excels in precise tuning and signal control applications, making it ideal for RF circuits, oscillators, and more. Its compact design and reliable quality guarantee seamless integration and enhanced efficiency, empowering you to elevate your projects while benefiting from NXP's renowned commitment to excellence. Experience cutting-edge technology that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for various applications.

Config: SINGLE

A single configuration allows for straightforward integration into circuits requiring only one varactor diode, optimizing space and design simplicity.

Frequency Band: ULTRA HIGH FREQUENCY

Operating in the ultra high frequency range makes this varactor diode ideal for applications such as RF and microwave circuits, enhancing performance in communication technologies.

Surface Mount: YES

The surface mount capability allows for efficient PCB layouts and automated assembly processes, reducing manufacturing costs and improving reliability.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design that facilitates integration into various circuit layouts without consuming excessive space.

No. of Terminals: 3

With three terminals, this diode offers flexible connection options, making it versatile for varying circuit requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, ensuring the component can fit into compact designs without compromising functionality.

Terminal Position: DUAL

Dual terminal positioning enhances the ease of soldering and improves electrical connectivity, contributing to better performance in circuit operations.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, it provides tunable capacitance, making it an excellent choice for voltage-controlled oscillators and RF tuning applications.

Terminal Form: GULL WING

The gull wing terminal form ensures stable and reliable solder joints, essential for maintaining electrical connections in high-frequency applications.

Diode Element Material: SILICON

Silicon is a widely used semiconductor material that offers reliable performance and thermal stability, ensuring longevity and consistent behavior in electronic circuits.

Technical Specifications

Varactor Diodes BBY31TRL13 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Frequency Band:

ULTRA HIGH FREQUENCY

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

Trade Compliance

BBY31TRL13 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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