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BB148/T3

NXP Semiconductors

BB148/T3 by NXP Semiconductors

VARIABLE CAPACITANCE DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,783 parts In-Stock

1+ parts

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3,783

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Vyrian

USA . 3,494 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,494

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Anansix

USA . 1,961 parts In-Stock

1+ parts

-

100+ parts

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1,961

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,198 parts In-Stock

1+ parts

$1.010

100+ parts

-

1k+ parts

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10k+ parts

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1,198

$1.010

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Native Components

USA . 470 parts In-Stock

1+ parts

$122.747

100+ parts

-

1k+ parts

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10k+ parts

$117.837

470

$122.747

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$117.837

Northwest PG Solutions

USA . 1,548 parts In-Stock

1+ parts

$135.022

100+ parts

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1,548

$135.022

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UNI Independent Distributors

Spain . 1,396 parts In-Stock

1+ parts

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1,396

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Corphita

USA . 448 parts In-Stock

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448

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Technical Specifications

Varactor Diodes BB148/T3 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Additional Features:

2% MATCHED SETS OF 10 DIODES ARE AVAILABLE

Minimum Breakdown Voltage:

30 V

Config:

SINGLE

Minimum Diode Capacitance Ratio:

14.5

Nominal Diode Capacitance:

39.3 pF

Diode Element Material:

SILICON

Frequency Band:

VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Reverse Current:

.01 uA

Reverse Test Voltage:

30 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Trade Compliance

BB148/T3 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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