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BBY31TRL

NXP Semiconductors

BBY31TRL by NXP Semiconductors

BBY31TRL by NXP Semiconductors is a variable capacitance diode designed for ultra-high frequency applications. It features a compact rectangular package with 3 terminals and surface mount capability. Ideal for tuning circuits, it enhances performance in RF devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,868 parts In-Stock

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2,868

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Digiode

USA . 907 parts In-Stock

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907

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Vyrian

USA . 182 parts In-Stock

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182

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Distributors (Availability)

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One Stop Electronics

USA . 1,554 parts In-Stock

1+ parts

$3.010

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1,554

$3.010

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UNI Independent Distributors

Spain . 3,490 parts In-Stock

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3,490

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Corphita

USA . 1,572 parts In-Stock

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1,572

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Northwest PG Solutions

USA . 1,137 parts In-Stock

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1,137

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Native Components

USA . 840 parts In-Stock

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840

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Overview

Elevate your designs with the BBY31TRL varactor diode from NXP Semiconductors, a trusted leader in innovative semiconductor solutions. This high-quality device excels in ultra-high frequency applications, offering unmatched performance and reliability. Its compact surface mount design ensures efficient space utilization while enabling superior tuning capabilities. Experience enhanced signal quality and versatility, empowering you to create cutting-edge electronics that stand out in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the diode suitable for various applications.

Config: SINGLE

A single configuration allows for a simpler design and integration into circuits, facilitating easier assembly and reduced complexity.

Frequency Band: ULTRA HIGH FREQUENCY

This diode's capability to operate in the ultra high frequency range makes it ideal for communication applications, such as RF and microwave circuits.

Surface Mount: YES

Surface mount technology (SMT) allows for compact designs, enabling higher density on circuit boards and improving overall performance.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCB layouts, allowing for efficient use of board real estate and easier alignment during assembly.

No. of Terminals: 3

Having three terminals provides flexibility in circuit design and configuration, enhancing the versatility of the diode for various applications.

Package Style (Meter): SMALL OUTLINE

A small outline package style reduces size and weight, making it easier to integrate into compact electronic devices and enhancing portability.

Terminal Position: DUAL

Dual terminal positioning allows for more stable connections and reduces the chances of mechanical stress on the solder joints, improving reliability.

Diode Type: VARIABLE CAPACITANCE DIODE

Variable capacitance diodes are highly suitable for tuning circuits, providing excellent performance in applications such as voltage-controlled oscillators and RF modulators.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering during assembly, enhancing manufacturability and ensuring reliable electrical connections.

Diode Element Material: SILICON

Silicon is a widely used semiconductor material that ensures consistent performance and reliability, making it suitable for a range of electronic applications.

Technical Specifications

Varactor Diodes BBY31TRL attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Frequency Band:

ULTRA HIGH FREQUENCY

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

Trade Compliance

BBY31TRL Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

NSN

5961-01-373-7056, 5961013737056

NIIN

013737056

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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