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BBY40TRL13

NXP Semiconductors

BBY40TRL13 by NXP Semiconductors

BBY40TRL13 by NXP Semiconductors is a variable capacitance diode designed for very high frequency applications. It features a min capacitance ratio of 8, comes in a small outline package with 3 terminals, and utilizes silicon as the diode element material. Ideal for RF tuning circuits, it offers reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,825 parts In-Stock

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Vyrian

USA . 1,320 parts In-Stock

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1,320

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Digiode

USA . 892 parts In-Stock

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892

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Native Components

USA . 967 parts In-Stock

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$0.785

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967

$0.785

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Northwest PG Solutions

USA . 1,176 parts In-Stock

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$0.864

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1,176

$0.864

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One Stop Electronics

USA . 210 parts In-Stock

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$2.010

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210

$2.010

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UNI Independent Distributors

Spain . 5,659 parts In-Stock

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5,659

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Corphita

USA . 552 parts In-Stock

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552

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Overview

Unlock superior performance with the BBY40TRL13 varactor diode from NXP Semiconductors, a trusted leader in innovation. Designed for very high frequency applications, this compact, surface-mount solution enhances tuning capabilities, ensuring optimal signal quality. Its exceptional capacitance ratio and reliable construction provide unmatched value, making it ideal for RF circuits in communication systems. Elevate your projects with NXP’s commitment to quality and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and resistance to environmental factors, making the diode reliable for various applications.

Config: SINGLE

A single configuration simplifies the design and integration process, making it an ideal choice for compact electronic devices.

Frequency Band: VERY HIGH FREQUENCY

Supporting very high frequency operations allows this varactor diode to be utilized in advanced RF applications, enhancing signal quality and performance.

Surface Mount: YES

Surface mount technology enables easier and more efficient assembly in modern devices, contributing to reduced manufacturing costs and increased application flexibility.

Package Shape: RECTANGULAR

The rectangular package shape aids in optimized board layout and minimizes space, which is crucial for densely packed circuitry.

No. of Terminals: 3

The three-terminal design allows for versatile connectivity options, making it adaptable for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style is perfect for applications where space is at a premium without compromising performance.

Terminal Finish: Tin (Sn)

Tin terminal finish ensures a good soldering process and enhances reliability in electrical connections, which is crucial for long-term performance.

Terminal Position: DUAL

The dual terminal position provides flexibility in layout design and can aid in reducing parasitic effects, ensuring better performance.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, it allows for tunable capacitance in circuits, which is essential for frequency modulation and tuning applications.

Terminal Form: GULL WING

Gull wing terminal form allows for easier inspection and soldering, improving manufacturing efficiency and reliability.

Diode Element Material: SILICON

Silicon as the diode element material ensures high performance and reliability, allowing the diode to function effectively in a variety of conditions.

Minimum Diode Capacitance Ratio: 8

A minimum capacitance ratio of 8 indicates a wide tunability range, making this diode suitable for precise applications in RF and microwave circuits.

Technical Specifications

Varactor Diodes BBY40TRL13 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Config:

SINGLE

Minimum Diode Capacitance Ratio:

8

Diode Element Material:

SILICON

Frequency Band:

VERY HIGH FREQUENCY

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Position:

Trade Compliance

BBY40TRL13 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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