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BB240TRL13

NXP Semiconductors

BB240TRL13 by NXP Semiconductors

BB240TRL13 by NXP Semiconductors is a variable capacitance diode designed for very high frequency applications. It features a min capacitance ratio of 14, comes in a round glass package, and supports surface mount technology. Ideal for RF tuning and voltage-controlled oscillators.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,886 parts In-Stock

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3,886

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Digiode

USA . 1,395 parts In-Stock

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1,395

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Anansix

USA . 834 parts In-Stock

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834

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One Stop Electronics

USA . 546 parts In-Stock

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$1.010

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UNI Independent Distributors

Spain . 2,729 parts In-Stock

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Northwest PG Solutions

USA . 1,982 parts In-Stock

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Corphita

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Native Components

USA . 595 parts In-Stock

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595

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Overview

Experience unmatched performance with the BB240TRL13 by NXP Semiconductors, a leader in innovative semiconductor solutions. This variable capacitance diode is designed for very high frequency applications, offering superior quality and reliability. With its glass package and isolated case connection, it ensures optimal functionality in compact designs. Elevate your projects with NXP’s cutting-edge technology, delivering exceptional value and performance for diverse applications!

Feature Benefit Bullets

Package Body Material: GLASS

The use of glass as the package body material provides excellent isolation and thermal stability, making this varactor diode suitable for high-frequency applications.

Config: SINGLE

A single configuration allows for easy integration into various circuit designs, enhancing versatility in applications.

Frequency Band: VERY HIGH FREQUENCY

Designed for very high frequency, this varactor diode is ideal for RF and microwave applications, ensuring optimal performance in those ranges.

Surface Mount: YES

Surface mount capability simplifies assembly and reduces overall circuit size, contributing to compact design solutions.

Package Shape: ROUND

The round package shape allows for consistent RF characteristics and aids in efficient heat dissipation during operation.

No. of Terminals: 2

With only two terminals, this diode ensures straightforward connectivity, reducing complexity in circuit design.

Package Style (Meter): LONG FORM

The long form packaging style allows for enhanced mounting stability and improved layout flexibility on PCBs.

Terminal Position: END

End terminal positioning facilitates easier routing on printed circuit boards, helping in maintaining optimal performance and minimizing signal loss.

Case Connection: ISOLATED

Isolated case connection ensures minimal interference and enhances the performance of the device in sensitive applications.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, it is excellent for tuning and frequency modulation applications, making it highly versatile in communication systems.

Terminal Form: WRAP AROUND

Wrap around terminals provide robust mechanical connections and excellent electrical performance, critical for high-frequency applications.

Diode Element Material: SILICON

Silicon as the diode element material offers good electrical properties and reliability, ensuring efficient operation across a wide range of conditions.

Minimum Diode Capacitance Ratio: 14

A high minimum capacitance ratio of 14 allows for effective tuning capabilities, making it an excellent choice for applications requiring significant capacitance variation.

Technical Specifications

Varactor Diodes BB240TRL13 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Additional Features:

3% MATCHED SETS ARE AVAILABLE

Case Connection:

ISOLATED

Config:

SINGLE

Minimum Diode Capacitance Ratio:

14

Diode Element Material:

SILICON

Frequency Band:

VERY HIGH FREQUENCY

JESD-30 Code:

O-LELF-R2

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

END

Trade Compliance

BB240TRL13 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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