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BB249TRL

NXP Semiconductors

BB249TRL by NXP Semiconductors

BB249TRL by NXP Semiconductors is a single, surface-mount variable capacitance diode designed for very high frequency applications. It features a min capacitance ratio of 8 and comes in a long-form round glass package with isolated case connections. Ideal for RF tuning and voltage-controlled oscillators, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 2,447 parts In-Stock

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Digiode

USA . 1,859 parts In-Stock

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1,859

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Anansix

USA . 365 parts In-Stock

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365

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One Stop Electronics

USA . 1,373 parts In-Stock

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$2.010

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$2.010

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Native Components

USA . 279 parts In-Stock

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$12.979

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279

$12.979

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Northwest PG Solutions

USA . 77 parts In-Stock

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$14.277

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$12.850

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77

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$12.850

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UNI Independent Distributors

Spain . 8,378 parts In-Stock

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Corphita

USA . 1,690 parts In-Stock

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Overview

Unlock unparalleled performance with the BB249TRL from NXP Semiconductors. This high-quality varactor diode excels in very high frequency applications, offering remarkable reliability and precision. With its innovative glass package and advanced silicon technology, it ensures optimal signal tuning for your projects. Experience the advantages of a trusted manufacturer, enhancing your designs while benefiting from superior capacitance ratios. Elevate your applications with NXP’s commitment to excellence!

Feature Benefit Bullets

Package Body Material: GLASS

The glass body material provides excellent thermal stability and is resistant to environmental factors, enhancing the diode's reliability in high-performance applications.

Config: SINGLE

A single configuration simplifies the circuit design, making this varactor diode ideal for compact and efficient applications.

Frequency Band: VERY HIGH FREQUENCY

Designed for very high frequency applications, this varactor diode ensures optimal performance in RF circuits, including oscillators and modulators.

Surface Mount: YES

Surface mount capability allows for easy integration into modern PCB designs, leading to reduced space requirements and improved manufacturing efficiency.

Package Shape: ROUND

The round package shape contributes to a uniform thermal and electrical performance, making it suitable for various mounting configurations.

No. of Terminals: 2

With only two terminals, this design simplifies connections and reduces potential points of failure, enhancing the diode's reliability.

Package Style (Meter): LONG FORM

The long form package style accommodates various application needs, providing flexibility in mounting while maintaining good electrical performance.

Terminal Position: END

End terminal positioning ensures straightforward access for soldering and integration in space-constrained environments, facilitating easier designs.

Case Connection: ISOLATED

Isolated case connection prevents unwanted interactions with other components, enhancing circuit stability and performance.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, it allows for dynamic tuning in RF applications, making it suitable for frequency modulation and tuning circuits.

Terminal Form: WRAP AROUND

Wrap around terminal form provides excellent mechanical stability and improves solder joint quality, ensuring reliable connections in circuit designs.

Diode Element Material: SILICON

Silicon material enhances performance under varying conditions, providing good capacitance characteristics and making it suitable for high-frequency applications.

Minimum Diode Capacitance Ratio: 8

A minimum capacitance ratio of 8 allows for significant tuning ranges, making this diode an excellent choice for applications requiring precise frequency adjustments.

Technical Specifications

Varactor Diodes BB249TRL attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Additional Features:

3% MATCHED SETS ARE AVAILABLE

Case Connection:

ISOLATED

Config:

SINGLE

Minimum Diode Capacitance Ratio:

8

Diode Element Material:

SILICON

Frequency Band:

VERY HIGH FREQUENCY

JESD-30 Code:

O-LELF-R2

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

END

Trade Compliance

BB249TRL Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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