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BB215TRL13

NXP Semiconductors

BB215TRL13 by NXP Semiconductors

BB215TRL13 by NXP Semiconductors is a variable capacitance diode designed for ultra-high frequency applications. It features a min capacitance ratio of 7.6, comes in a round glass package, and supports surface mount technology. Ideal for tuning circuits and RF applications, it ensures reliable performance with its isolated case connection.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,683 parts In-Stock

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2,683

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Digiode

USA . 2,463 parts In-Stock

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2,463

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Vyrian

USA . 159 parts In-Stock

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159

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Native Components

USA . 829 parts In-Stock

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$0.253

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$0.243

829

$0.253

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$0.243

Northwest PG Solutions

USA . 1,286 parts In-Stock

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$0.278

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$0.245

1,286

$0.278

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$0.245

One Stop Electronics

USA . 1,443 parts In-Stock

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$1.010

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1,443

$1.010

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UNI Independent Distributors

Spain . 7,876 parts In-Stock

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Corphita

USA . 2,968 parts In-Stock

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Overview

Unlock unparalleled performance with the BB215TRL13 from NXP Semiconductors, a leading name in innovative solutions. This ultra-high frequency varactor diode seamlessly enhances your designs, offering superior tuning capabilities and reliability in various applications, from RF circuits to telecommunications. With its glass packaging and isolated terminals, it ensures durability and optimal functionality, delivering exceptional value and peace of mind for engineers and manufacturers alike.

Feature Benefit Bullets

Package Body Material: GLASS

The glass package material offers superior durability and protection against environmental factors, ensuring reliable performance in demanding conditions.

Config: SINGLE

A single configuration simplifies integration into circuits, making it easier to design compact and efficient electronic systems.

Frequency Band: ULTRA HIGH FREQUENCY

Designed for ultra high frequency applications, this varactor diode is ideal for RF circuits, enhancing performance in communication devices.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and enables automated assembly, resulting in lower production costs.

Package Shape: ROUND

The round package shape provides ease of mounting and can contribute to improving the thermal performance of the diode.

No. of Terminals: 2

Having only 2 terminals simplifies the design and reduces potential points of failure in the circuit.

Package Style (Meter): LONG FORM

The long form package style can enhance the connectivity options and facilitate better integration into various circuit layouts.

Terminal Position: END

End terminal positioning is advantageous for certain layout designs, allowing for easier routing of connections.

Case Connection: ISOLATED

An isolated case connection ensures that the diode operates without affecting other components, enhancing overall circuit stability.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, it provides adjustable capacitance, making it suitable for tuning and frequency modulation applications.

Terminal Form: WRAP AROUND

Wrap around terminals offer excellent solder joint reliability, helping to maintain strong connections in varied operating conditions.

Diode Element Material: SILICON

Silicon is a widely used semiconductor material known for its excellent electrical properties, resulting in predictable performance.

Minimum Diode Capacitance Ratio: 7.6

A minimum capacitance ratio of 7.6 indicates significant variability in capacitance, making this diode versatile for different tuning needs.

Technical Specifications

Varactor Diodes BB215TRL13 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Additional Features:

3% MATCHED SETS ARE AVAILABLE

Case Connection:

ISOLATED

Config:

SINGLE

Minimum Diode Capacitance Ratio:

7.6

Diode Element Material:

SILICON

Frequency Band:

ULTRA HIGH FREQUENCY

JESD-30 Code:

O-LELF-R2

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

GLASS

Package Shape:

Package Style (Meter):

LONG FORM

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

END

Trade Compliance

BB215TRL13 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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