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BB212

NXP Semiconductors

BB212 by NXP Semiconductors

VARIABLE CAPACITANCE DIODE; Terminal Position: BOTTOM; Terminal Form: THROUGH-HOLE; No. of Terminals: 3; Surface Mount: NO; Package Shape: ROUND;

Median Price

$2.130

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 355 parts In-Stock

1+ parts

-

100+ parts

$1.890

1k+ parts

$1.770

10k+ parts

$1.690

355

-

$1.890

$1.770

$1.690

Verical

USA . 350 parts In-Stock

1+ parts

-

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$2.371

1k+ parts

$2.269

10k+ parts

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350

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$2.371

$2.269

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Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 68 parts In-Stock

1+ parts

$9.840

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$9.840

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Vyrian

USA . 6,089 parts In-Stock

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Digiode

USA . 3,576 parts In-Stock

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Anansix

USA . 1,907 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,057 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 405 parts In-Stock

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Goldney Electronics S.L.

Spain . 54 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 40 parts In-Stock

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GES GmbH

Germany . 3 parts In-Stock

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3

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Distributors (Availability)

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Native Components

USA . 453 parts In-Stock

1+ parts

$2.069

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453

$2.069

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Northwest PG Solutions

USA . 2,091 parts In-Stock

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$2.276

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2,091

$2.276

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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UNI Independent Distributors

Spain . 1,048 parts In-Stock

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Corphita

USA . 489 parts In-Stock

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Assy Fe

Spain . 7 parts In-Stock

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Technical Specifications

Varactor Diodes BB212 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Minimum Breakdown Voltage:

12 V

Config:

COMMON CATHODE, 2 ELEMENTS

Diode Cap Tolerance:

3.5 %

Minimum Diode Capacitance Ratio:

22.5

Nominal Diode Capacitance:

500 pF

Diode Element Material:

SILICON

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CYLINDRICAL

Qualification:

Not Qualified

Maximum Reverse Current:

.05 uA

Reverse Test Voltage:

10 V

Surface Mount:

NO

Terminal Form:

Terminal Position:

Trade Compliance

BB212 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

NSN

5961-99-920-8268, 5961999208268

NIIN

999208268

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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