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74HC7030D,652

NXP Semiconductors

74HC7030D,652 by NXP Semiconductors

OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2 V;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,624 parts In-Stock

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8,624

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Digiode

USA . 2,985 parts In-Stock

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2,985

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Anansix

USA . 813 parts In-Stock

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813

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 2,364 parts In-Stock

1+ parts

$3.250

100+ parts

-

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2,364

$3.250

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Corohmni

South Africa . 153 parts In-Stock

1+ parts

$4.475

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153

$4.475

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Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$6.687

100+ parts

$6.085

1k+ parts

$5.483

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-

650

$6.687

$6.085

$5.483

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One Stop Electronics

USA . 1,040 parts In-Stock

1+ parts

$14.000

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1,040

$14.000

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AZTECH Wire

Italy . 386 parts In-Stock

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$20.000

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386

$20.000

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Component Stockers USA

USA . 324 parts In-Stock

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$99.990

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324

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 23,229 parts In-Stock

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UNI Independent Distributors

Spain . 7,938 parts In-Stock

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7,938

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Microchip USA

USA . 5,001 parts In-Stock

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Corphita

USA . 2,045 parts In-Stock

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2,045

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Native Components

USA . 57 parts In-Stock

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$2.866

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57

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$2.866

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Technical Specifications

FIFO 74HC7030D,652 attributes and parameters. Explore more FIFO devices from NXP Semiconductors

Specs

Maximum Access Time:

104 ns

Additional Features:

REGISTER BASED; BUBBLE BACK 3US

Maximum Clock Frequency (fCLK):

9.2 MHz

Cycle Time:

108.7 ns

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Memory Density:

576 bit

Memory IC Type:

Memory Width:

9

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FIFOs

Maximum Supply Current:

1 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74HC7030D,652 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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