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74AUP2G3404GW,125

NXP Semiconductors

74AUP2G3404GW,125 by NXP Semiconductors

NXP Semiconductors' 74AUP2G3404GW,125 is a logic gate with 20.9 ns propagation delay at 1.1V supply voltage. It features Schmitt Trigger technology, operates in automotive temperature grade range (-40 to 125 °C), and has a max seated height of 1.1mm. Ideal for applications requiring fast signal processing in compact spaces like automotive electronics.

Median Price

$0.212

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Arrow

USA . 290 parts In-Stock

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$0.102

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$0.053

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$0.038

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Mouser Electronics

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$0.230

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$0.119

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$0.114

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$0.103

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DigiKey

USA . 984 parts In-Stock

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$0.250

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$0.131

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$0.109

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TTI

USA . 6,000 parts In-Stock

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$0.089

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$0.089

Rochester

USA . 1,985 parts In-Stock

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$0.229

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$0.190

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$0.170

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Verical

USA . 1,985 parts In-Stock

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$0.212

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Chip1Stop

Japan . 1,560 parts In-Stock

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$0.125

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$0.080

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Digiode

USA . 2,974 parts In-Stock

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$0.083

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Nova Conductors

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$0.166

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Chip Stock

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Vyrian

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VNN

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Anansix

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Corphita

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Component Stockers USA

USA . 42,739 parts In-Stock

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$0.090

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$0.080

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$0.070

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$0.110

42,739

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$0.080

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$0.110

AZTECH Wire

Italy . 7,739 parts In-Stock

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Continental Prestige Electronics

USA . 3,120 parts In-Stock

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$0.166

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$0.163

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Argo Parts USA

USA . 865 parts In-Stock

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865

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Bastille Electronics

Australia . 500 parts In-Stock

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$0.158

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$0.148

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Corohmni

South Africa . 321 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Overview

Looking for high-quality logic gates for your automotive applications? Look no further than the 74AUP2G3404GW,125 by NXP Semiconductors. With a nominal supply voltage of 1.1V and a maximum operating temperature of 125°C, this compact device offers fast propagation delay and a reliable Schmitt trigger technology. Its dual terminal position and small outline package make it perfect for space-constrained designs. Trust NXP Semiconductors to deliver top-notch performance and durability in every product they create. Upgrade your automotive electronics with the 74AUP2G3404GW,125 and experience the difference!

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Makes the product lightweight and durable.

Propagation Delay At Nominal Supply

20.9 ns - Ensures fast signal transmission.

Surface Mount

YES - Allows for easy and compact installation.

No. of Functions

2 - Provides versatility in circuit design.

Package Shape

RECTANGULAR - Fits well in standard circuit layouts.

Nominal Supply Voltage / Vsup

1.1 V - Suitable for low power applications.

Load Capacitance (CL)

30 pF - Helps in maintaining signal integrity.

Power Supplies (V)

1.2/3.3 - Compatible with various power sources.

No. of Terminals

6 - Enables connectivity with other components.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Saves space on PCB.

Maximum I (ol)

1.7 Amp - Can handle high current loads.

Propagation Delay (tpd)

20.9 ns - Ensures accurate signal timing.

Maximum Operating Temperature

125 °C - Suitable for harsh environments.

Minimum Operating Temperature

40 °C - Can withstand extreme cold conditions.

Terminal Finish

TIN - Provides a corrosion-resistant coating.

Terminal Position

DUAL - Offers flexibility in circuit layout.

Maximum Seated Height

1.1 mm - Fits well in compact devices.

Width

1.25 mm - Ideal for tight PCB layouts.

Minimum Supply Voltage (Vsup)

0.8 V - Allows for operation at low voltages.

Maximum Time At Peak Reflow Temperature (s)

30 - Ensures reliable soldering during assembly.

Peak Reflow Temperature °C

260 - Can withstand high-temperature soldering processes.

Length

2 mm - Fits well in compact circuit designs.

Temperature Grade

AUTOMOTIVE - Suitable for automotive applications.

Schmitt Trigger

YES - Provides hysteresis for noise immunity.

Technology

CMOS - Low power consumption and high noise immunity.

Terminal Form

GULL WING - Convenient for automated assembly.

Packing Method

TR - Easy to handle and store.

Terminal Pitch

0.65 mm - Allows for high-density PCB layouts.

Maximum Supply Voltage (Vsup)

3.6 V - Suitable for a wide range of applications.

Technical Specifications

Logic Gates 74AUP2G3404GW,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

20.9 ns

Propagation Delay (tpd):

20.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AUP2G3404GW,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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