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74AUP1G09GW,125

NXP Semiconductors

74AUP1G09GW,125 by NXP Semiconductors

74AUP1G09GW,125 by NXP Semiconductors is a logic gate with a propagation delay of 24 ns and a load capacitance of 30 pF. It is used in automotive applications and has a max operating temperature of 125°C.

Median Price

$0.124

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Chip1Stop

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DigiKey

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Newark

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Verical

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Rochester

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TTI

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Future Electronics

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Element14

Singapore . 20,861 parts In-Stock

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Farnell

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Arrow

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TME

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$0.083

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$0.078

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Digiode

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IBS Electronics

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NAC Semi

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Chip Stock

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LIBRA Elektronik GmbH

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Aztec Data Supply Inc.

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Eastek

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Overview

Experience the power of high-quality logic gates with the 74AUP1G09GW,125 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors ensures exceptional performance and reliability in every product. Logic gates play a crucial role in various applications, from consumer electronics to automotive systems. With its compact size and surface mount capability, this product offers unmatched convenience and flexibility for your designs. Harness its open-drain output characteristics and Schmitt trigger technology to achieve precise signal processing. Trust the 74AUP1G09GW,125 to deliver outstanding results, making it the ideal choice for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection, making it suitable for various environments.

Propagation Delay At Nominal Supply: 24 ns

Fast propagation delay allows for quick signal processing, enhancing the overall performance of the product.

Surface Mount: YES

Surface mounting capability simplifies the installation process and saves space on the circuit board.

No. of Inputs: 2

Having 2 inputs provides flexibility in logic operations and allows for more complex circuit designs.

Nominal Supply Voltage / Vsup (V): 1.1

Low supply voltage helps in reducing power consumption and heat generation.

Load Capacitance (CL): 30 pF

Optimal load capacitance ensures stability and efficiency in signal transmission.

No. of Terminals: 5

Having a sufficient number of terminals enables easy connectivity and integration into existing circuits.

Maximum I (ol): 1.7 Amp

High maximum output current capacity allows for driving larger loads without any risk of damage.

Output Characteristics: OPEN-DRAIN

Open-drain output configuration provides versatility in connecting with other components and systems.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable operation in extreme temperature conditions, making it suitable for automotive applications.

Technical Specifications

Logic Gates 74AUP1G09GW,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

24 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AUP1G09GW,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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