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74AUP1G08GW

NXP Semiconductors

74AUP1G08GW by NXP Semiconductors

74AUP1G08GW by NXP Semiconductors is a logic gate with 2 inputs and a propagation delay of 19.4 ns. It operates at a nominal voltage of 1.1V and is suitable for automotive applications.

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Overview

Discover the 74AUP1G08GW, a high-quality logic gate by NXP Semiconductors. As a leading manufacturer in the industry, NXP is known for its cutting-edge technology and reliable products. This logic gate offers numerous benefits and advantages for a wide range of applications. With its compact size and surface mount capabilities, it is suitable for various electronic devices. Customers will appreciate its low propagation delay, ensuring fast and efficient performance. Furthermore, its robust construction and automotive-grade temperature tolerance make it a durable and reliable choice. Experience the value and superior performance that the 74AUP1G08GW brings to your projects.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The plastic/epoxy material of the package body provides durability and protection for the logic gates, making them suitable for various applications and environments.

Propagation Delay At Nominal Supply:

19.4 ns - With a low propagation delay, these logic gates ensure fast and efficient signal processing, enabling high-speed operations and reducing latency.

Surface Mount:

YES - The surface mount feature allows for easy and convenient installation, making these logic gates suitable for automated assembly processes and compact circuit designs.

No. of Functions:

1 - Having one function per logic gate simplifies circuit design, making them ideal for specific applications that require a single logical operation.

No. of Inputs:

2 - The two-input configuration provides flexibility in designing logical operations, allowing users to create various combinations and achieve desired outcomes.

Package Shape:

RECTANGULAR - The rectangular shape of the package enhances compatibility with standard board layouts, facilitating integration into existing electronic systems or circuits.

Nominal Supply Voltage / Vsup (V):

1.1 - These logic gates operate reliably within a nominal supply voltage of 1.1V, ensuring compatibility with a wide range of devices and power sources.

Load Capacitance (CL):

30 pF - With a load capacitance of 30 pF, these logic gates can efficiently drive capacitive loads, ensuring reliable signal transmission and minimizing signal degradation.

Power Supplies (V):

1.2/3.3 - The compatibility with multiple power supply voltages (1.2V and 3.3V) makes these logic gates versatile, enabling integration into diverse circuitry and system architectures.

No. of Terminals:

5 - The logic gates' five terminals provide straightforward connection options, simplifying circuit interconnections and allowing for efficient integration into larger electronics systems.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - The small outline, thin profile, and shrink pitch package style enhances space efficiency, making these logic gates suitable for compact electronic devices and miniaturized circuit design.

Maximum I (ol):

1.7 Amp - With a maximum output current of 1.7 Amps, these logic gates can drive high current applications, ensuring robust signal transmission without performance degradation.

Propagation Delay (tpd):

24 ns - The propagation delay of 24 ns ensures rapid signal processing, contributing to efficient circuit performance and reducing potential latency in data transmission.

Maximum Operating Temperature:

125 °C - With a maximum operating temperature of 125°C, these logic gates can operate reliably in high-temperature environments, making them suitable for demanding industrial or automotive applications.

Minimum Operating Temperature:

40 °C - The logic gates' minimum operating temperature of -40°C ensures reliable operation in extreme cold conditions, making them suitable for a wide range of environments and applications.

Terminal Finish:

TIN - The tin terminal finish provides a protective layer against corrosion or oxidation, ensuring long-term performance stability and reliability, particularly in challenging environments.

Terminal Position:

DUAL - The dual terminal position offers flexibility in PCB layout and connection options, accommodating various circuit designs and system interconnections.

Maximum Seated Height:

1.1 mm - With a compact maximum seated height of 1.1 mm, these logic gates can be effectively utilized in space-constrained designs or devices without compromising functionality.

Width:

1.25 mm - The narrow width of 1.25 mm allows for efficient placement and integration into crowded circuit boards, enabling compact and streamlined electronic designs.

Minimum Supply Voltage (Vsup):

0.8 V - These logic gates can operate within a minimum supply voltage of 0.8V, facilitating compatibility with low-voltage systems and enhancing power efficiency.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time of 30 seconds at peak reflow temperature ensures safe and reliable soldering when integrating the logic gates into circuit assemblies, minimizing the risk of component damage.

Peak Reflow Temperature °C:

260 - The peak reflow temperature of 260°C allows for secure and effective soldering during assembly, ensuring proper connection and long-term reliability in various manufacturing processes.

Length:

2.05 mm - With a compact length of 2.05 mm, these logic gates can be easily accommodated in small circuit board spaces, contributing to efficient and space-saving design solutions.

Temperature Grade:

AUTOMOTIVE - The automotive temperature grade indicates that these logic gates can reliably operate within the temperature range required for automotive applications, making them suitable for integration into vehicles and automotive systems.

Technology:

CMOS - Utilizing CMOS technology, these logic gates offer low power consumption, high noise immunity, and compatibility with a wide range of input and output voltage levels, making them versatile and efficient components for various electronic systems.

Terminal Form:

GULL WING - The gull-wing terminal form allows for convenient surface mount soldering, ensuring secure and reliable connections during assembly and enhancing overall product reliability.

Packing Method:

TR - The TR packing method, typically tape and reel, facilitates automated handling and assembly processes, enabling efficient integration of these logic gates into larger production systems.

Terminal Pitch:

0.65 mm - With a terminal pitch of 0.65 mm, these logic gates can be easily integrated into fine-pitch circuit boards, supporting miniaturized and densely-packed electronic designs.

Moisture Sensitivity Level (MSL):

1 - With an MSL of 1, these logic gates have a low moisture sensitivity, reducing the risk of component damage during storage, transportation, or reflow processes.

Maximum Supply Voltage (Vsup):

3.6 V - These logic gates can handle a maximum supply voltage of 3.6V, allowing for compatibility with a wide range of voltage levels and facilitating integration into diverse electronic systems.

Technical Specifications

Logic Gates 74AUP1G08GW attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

19.4 ns

Propagation Delay (tpd):

24 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AUP1G08GW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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