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74AUP1G08GW,125

NXP Semiconductors

74AUP1G08GW,125 by NXP Semiconductors

NXP Semiconductors' 74AUP1G08GW,125 is a CMOS Logic Gate with 2 inputs and 24 ns propagation delay at 1.8V. It operates in automotive-grade temperature range (-40 to 125 °C) and has a max supply voltage of 3.6V. Ideal for applications requiring fast signal processing in compact designs due to its small outline package style.

Median Price

$0.058

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

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Mouser Electronics

USA . 8,900 parts In-Stock

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$0.150

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$0.075

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$0.062

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$0.056

8,900

$0.150

$0.075

$0.062

$0.056

Newark

USA . 5,459 parts In-Stock

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$0.263

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$0.131

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$0.109

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5,459

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$0.131

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EBV Elektronik

Germany . 30,000 parts In-Stock

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Arrow

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Verical

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Chip1Stop

Japan . 14,420 parts In-Stock

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Rochester

USA . 13,700 parts In-Stock

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TTI

USA . 12,000 parts In-Stock

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Future Electronics

Canada . 12,000 parts In-Stock

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Element14

Singapore . 11,940 parts In-Stock

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DigiKey

USA . 7,449 parts In-Stock

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Farnell

UK . 414 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 3,452 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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Bristol Electronics

USA . 8,251 parts In-Stock

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$0.040

TME

Poland . 2,869 parts In-Stock

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$0.447

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Chip Stock

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IBS Electronics

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North Shore Components

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NAC Semi

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Cyclops Electronics Ltd

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Inventory MP

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Prism Electronics

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Speed Components Ltd

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Sensible Micro Corp

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Distributors (Availability)

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Ampacity Inc.

Singapore . 15,678 parts In-Stock

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Semicontronic

India . 15,560 parts In-Stock

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Corphita

USA . 1,924 parts In-Stock

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AZTECH Wire

Italy . 10,260 parts In-Stock

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Aranea Global

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Argo Parts USA

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Continental Prestige Electronics

USA . 12,810 parts In-Stock

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$0.156

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$0.095

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Corohmni

South Africa . 572 parts In-Stock

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Aztec Data Supply Inc.

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Advanced Electronics

New Zealand . 114 parts In-Stock

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GreenTree Electronics

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Eastek

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Authorized Procurement Solutions

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UNI Independent Distributors

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iodParts Technologies Inc.

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Supply Digital

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Glotronic Ltd.

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A-Z Elektronik GmbH

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Overview

Unlock the power of seamless logic integration with the 74AUP1G08GW,125 by NXP Semiconductors. Designed with precision and reliability in mind, this Logic Gate offers unparalleled performance in a wide range of applications. From automotive to industrial settings, this product delivers fast propagation delay and low power consumption, ensuring optimal efficiency. Say goodbye to compatibility issues and hello to seamless integration with this high-quality component. Elevate your projects with the 74AUP1G08GW,125 and experience the difference NXP Semiconductors can make for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the logic gates, making them suitable for various environments.

Propagation Delay At Nominal Supply: 24 ns

Fast propagation delay ensures quick response time for signal processing.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Inputs: 2

Suitable for basic logic operations and circuits with two input signals.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low supply voltage, conserving power.

Load Capacitance (CL): 30 pF

Capable of driving a moderate load capacitance for effective signal transmission.

Power Supplies (V): 1.2/3.3

Supports multiple power supply options for flexibility in different system configurations.

Maximum I (ol): 1.7 Amp

High output current allows for driving larger loads or multiple devices.

Minimum Operating Temperature: -40 °C

Can withstand harsh operating environments with low temperatures.

Maximum Operating Temperature: 125 °C

Offers reliability and performance in high-temperature conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Logic Gates 74AUP1G08GW,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

24 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AUP1G08GW,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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