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74AUP1G32GW-Q100,125

NXP Semiconductors

74AUP1G32GW-Q100,125 by NXP Semiconductors

NXP Semiconductors' 74AUP1G32GW-Q100,125 is a CMOS Logic Gate with 2 inputs and 23.7 ns propagation delay. AEC-Q100 screening makes it ideal for automotive applications, operating b/w -40 to 125 °C. With a small outline package style and 0.65 mm terminal pitch, it's suitable for compact designs in automotive electronics.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Nova Conductors

Japan . 100 parts In-Stock

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Digiode

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Vyrian

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Anansix

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Netroflash

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AZTECH Wire

Italy . 192 parts In-Stock

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One Stop Electronics

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Microchip USA

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Aztec Data Supply Inc.

USA . 2,621 parts In-Stock

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Semicontronic

India . 830 parts In-Stock

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Corohmni

South Africa . 1,271 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Argo Parts USA

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Continental Prestige Electronics

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Overview

Experience seamless performance and reliability with the NXP Semiconductors 74AUP1G32GW-Q100,125 Logic Gate. Designed with precision by a trusted manufacturer, this compact device offers a wide range of applications in automotive settings, ensuring optimal functionality even in challenging conditions. With its advanced technology and high-quality construction, this logic gate guarantees efficient operation and long-term durability. Upgrade your projects with the value and benefits that only NXP Semiconductors can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for automotive applications where weight and cost are important factors.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and making the product suitable for compact electronic designs.

Nominal Supply Voltage / Vsup (V): 1.1

The nominal supply voltage of 1.1V ensures compatibility with a wide range of systems and circuits, making it versatile for various applications.

Propagation Delay (tpd): 23.7 ns

The low propagation delay of 23.7ns ensures fast signal processing, making the product ideal for high-speed applications where quick response times are critical.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the product to withstand harsh automotive environments, ensuring reliability and longevity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for automotive applications.

Technical Specifications

Logic Gates 74AUP1G32GW-Q100,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G5

Length:

2.05 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

23.7 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74AUP1G32GW-Q100,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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