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74AUP1T34GW

NXP Semiconductors

74AUP1T34GW by NXP Semiconductors

NXP Semiconductors' 74AUP1T34GW is a CMOS logic gate with a propagation delay of 30.5 ns at 1.2V, suitable for automotive applications. It has a max operating temperature of 125°C and can handle a load capacitance of 30 pF. This surface-mount device features dual-terminal position and tin finish, making it ideal for compact designs in automotive electronics.

Median Price

$0.270

Lifecycle Status

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10

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1k+

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UK . 4,200 parts In-Stock

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AZTECH Wire

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Overview

Discover the NXP Semiconductors 74AUP1T34GW, a top-of-the-line logic gate that offers unmatched quality and reliability. Perfect for a wide range of applications, this product boasts a nominal supply voltage of 1.2V and a maximum operating temperature of 125°C, making it ideal for automotive use. With a compact design and superior performance, the 74AUP1T34GW provides customers with the value and benefits they need to take their projects to the next level. Experience the innovation and efficiency of NXP Semiconductors with this exceptional logic gate.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 30.5 ns

Fast propagation delay allows for quick signal processing, making the product suitable for applications requiring rapid data transmission.

Surface Mount: YES

Easy to integrate into circuit boards, simplifying assembly and reducing overall production time.

Nominal Supply Voltage / Vsup (V): 1.2

Low power consumption at a moderate voltage level, making it energy-efficient and cost-effective to operate.

Load Capacitance (CL): 30 pF

Optimal load capacitance for stable performance and reduced signal distortion.

Maximum I (ol): 1.7 Amp

High output current capability allows for driving multiple loads without external amplification, increasing versatility of use.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliability in various environmental conditions, making it suitable for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and wide operating voltage range, making the product efficient and reliable.

Technical Specifications

Logic Gates 74AUP1T34GW attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

30.5 ns

Propagation Delay (tpd):

33.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AUP1T34GW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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