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MT48LC8M16A2P-6A:GTR

Micron Technology

MT48LC8M16A2P-6A:GTR by Micron Technology

Micron Technology's MT48LC8M16A2P-6A:GTR is a 8MX16 Synchronous DRAM with a memory density of 134217728 bit. It operates at a max temperature of 70°C and has a supply voltage range of 3V to 3.6V. This DRAM is commonly used in applications requiring high-speed data storage and retrieval, such as computer systems and networking devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 15,500 parts In-Stock

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15,500

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Vyrian

USA . 8,274 parts In-Stock

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8,274

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Digiode

USA . 1,251 parts In-Stock

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1,251

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Nova Conductors

Japan . 62 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 430 parts In-Stock

1+ parts

$6.171

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430

$6.171

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Ampacity Inc.

Singapore . 1,459 parts In-Stock

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$16.000

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1,459

$16.000

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QUARKTWIN TECHNOLOGY LTD

USA . 13,069 parts In-Stock

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13,069

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Continental Prestige Electronics

USA . 6,312 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Argo Parts USA

USA . 4,427 parts In-Stock

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4,427

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Speed Components Ltd (Excess)

Israel . 1,130 parts In-Stock

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1,130

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Corphita

USA . 823 parts In-Stock

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823

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Microchip USA

USA . 104 parts In-Stock

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104

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Overview

Experience top-notch quality and performance with the MT48LC8M16A2P-6A:GTR by Micron Technology. As a leading manufacturer in the industry, Micron Technology ensures that each product meets the highest standards. This DRAM module offers exceptional value and benefits to customers, providing reliable and efficient memory solutions. With its compact size and surface mount capability, it is perfect for a wide range of applications. Whether you need it for gaming, multimedia, or data-intensive tasks, this product delivers seamless performance. Trust Micron Technology for all your memory needs and experience the advantages of their state-of-the-art technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's package body material is made of plastic/epoxy, which provides durability and protection for the internal components, making it a reliable choice.

Surface Mount: YES

With its surface mount capability, this product can be easily soldered onto circuit boards, enabling efficient and space-saving integration into electronic devices.

No. of Functions: 1

Featuring a single function, this product is simple and straightforward to use, making it ideal for various applications where a dedicated function is required.

Package Shape: RECTANGULAR

The rectangular package shape of this product offers ease of handling and mounting, ensuring compatibility with standard manufacturing processes.

Operating Mode: SYNCHRONOUS

The synchronous operating mode of this product allows for synchronized data transfers, enabling high-speed performance and efficient data handling.

Self Refresh: YES

With the self-refresh capability, this product can automatically refresh its memory content without the need for external intervention, providing uninterrupted operation and convenience.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage of this product ensures reliable and stable power delivery, contributing to consistent and efficient performance.

No. of Terminals: 54

Featuring 54 terminals, this product offers versatile connectivity options, facilitating seamless integration into various electronic systems and applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style of this product enables space-saving designs, making it suitable for compact electronic devices with limited physical dimensions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can perform reliably even under demanding environmental conditions, ensuring its suitability for various applications.

Organization: 8MX16

The organization of this product as 8Mx16 indicates a memory capacity of 8 million words, each consisting of 16 memory bits, making it suitable for data storage and retrieval needs.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that this product remains functional even in cold environments, enhancing its versatility and dependability.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable electrical connections and prolonged product lifespan.

Terminal Position: DUAL

With dual terminal positions, this product allows flexible mounting options, enhancing its compatibility with various circuit board layouts and assembly processes.

No. of Ports: 1

Featuring a single port, this product provides efficient data transfer between the DRAM and the external devices, simplifying system design and optimization.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2mm ensures compatibility with low-profile applications, enabling seamless integration into space-constrained electronic designs.

Width: 10.16 mm

With a width of 10.16mm, this product offers a compact form factor, providing versatility for applications with limited board space requirements.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V guarantees stable power delivery, ensuring proper operation and performance consistency in various scenarios.

Length: 22.22 mm

Measuring 22.22mm in length, this product offers a compact size, making it suitable for applications with limited physical space available.

Temperature Grade: COMMERCIAL

This product is classified as a commercial-grade component, ensuring its suitability for a wide range of non-extreme temperature applications, providing reliability and compatibility.

Access Mode: FOUR BANK PAGE BURST

The four bank page burst access mode of this product allows for rapid data access and efficient memory utilization, enhancing overall system performance.

Technology: CMOS

Based on CMOS technology, this product offers low power consumption, high-speed operation, and enhanced noise immunity, making it an efficient and reliable choice.

Terminal Form: GULL WING

Featuring gull wing terminal form, this product ensures secure mechanical and electrical connections, enhancing durability and facilitating automated assembly processes.

No. of Words: 8388608 words

With a total of 8,388,608 memory words, this product provides a large memory capacity for storing and accessing data, meeting the requirements of various data-intensive applications.

Memory Width: 16

The memory width of 16 bits facilitates efficient data transfer and processing, making this product suitable for applications demanding high-speed data handling.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, this product offers compatibility with standard circuit board layouts and assembly processes, simplifying integration and reducing manufacturing complexity.

No. of Words Code: 8M

The "8M" words code specifies the memory capacity of 8 million words, allowing for substantial data storage capabilities and flexibility across multiple applications.

Maximum Supply Voltage (Vsup): 3.6 V

Featuring a maximum supply voltage of 3.6V, this product ensures stable and reliable power delivery under varying operating conditions, contributing to consistent performance and longevity.

Memory Density: 134217728 bit

With a memory density of 134,217,728 bits, this product offers a high storage capacity, enabling efficient data storage and retrieval for demanding applications.

Memory IC Type: SYNCHRONOUS DRAM

This product is classified as a synchronous dynamic random-access memory (DRAM), providing high-speed access to stored data and efficient memory management.

Maximum Access Time: 5.4 ns

With a maximum access time of 5.4 nanoseconds, this product ensures fast data retrieval and processing, enabling quick response times and enhanced system performance.

Technical Specifications

DRAM MT48LC8M16A2P-6A:GTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

MT48LC8M16A2P-6A:GTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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