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MT48LC4M32B2P-6AXIT:LTR

Micron Technology

MT48LC4M32B2P-6AXIT:LTR by Micron Technology

Micron Technology's MT48LC4M32B2P-6AXIT:LTR is a 4MX32 Synchronous DRAM with a memory density of 134217728 bits. It operates at a nominal voltage of 3.3V and has a max access time of 5.4 ns. This memory IC is commonly used in industrial applications requiring high-speed data storage and retrieval.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,761 parts In-Stock

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2,761

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Digiode

USA . 1,106 parts In-Stock

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1,106

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Corohmni

South Africa . 102 parts In-Stock

1+ parts

$3.958

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102

$3.958

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AZTECH Wire

Italy . 729 parts In-Stock

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$11.808

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729

$11.808

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Ampacity Inc.

Singapore . 982 parts In-Stock

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$21.000

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982

$21.000

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Semicontronic

India . 858 parts In-Stock

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$23.000

100+ parts

$22.425

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$22.310

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858

$23.000

$22.425

$22.310

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Continental Prestige Electronics

USA . 3,693 parts In-Stock

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Argo Parts USA

USA . 3,299 parts In-Stock

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Corphita

USA . 2,137 parts In-Stock

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2,137

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Microchip USA

USA . 210 parts In-Stock

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Overview

Discover the cutting-edge MT48LC4M32B2P-6AXIT:LTR by Micron Technology, a high-quality DRAM that offers unparalleled performance and reliability. With its advanced technology and innovative design, this product is perfect for a wide range of applications. Experience seamless operation and lightning-fast speeds with its synchronous operating mode and self-refresh capability. Its compact package body material ensures durability, while its small outline and thin profile make it easy to integrate into any system. Trust in Micron Technology's expertise and enjoy the value, benefits, and advantages that this exceptional product brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the DRAM, making it a reliable choice for various applications.

Surface Mount: YES

With surface mount capability, this DRAM can easily be integrated into circuit boards, saving space and simplifying the assembly process.

No. of Functions: 1

This DRAM offers a single function, making it straightforward to use and compatible with a variety of systems.

Screening Level: AEC-Q100

Meeting the AEC-Q100 screening level ensures that this DRAM is suitable for automotive applications, guaranteeing high quality and reliability.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and utilization of space on circuit boards, making the DRAM a practical choice for compact designs.

Operating Mode: SYNCHRONOUS

The synchronous operating mode of this DRAM ensures efficient communication and synchronization with the system, enhancing overall performance.

Self Refresh: YES

With self-refresh capability, this DRAM can maintain data integrity even in power-saving modes, making it energy-efficient and suitable for battery-powered devices.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage allows for compatibility with a wide range of systems, offering versatility in integration and operation.

No. of Terminals: 86

With 86 terminals, this DRAM provides sufficient connectivity options, enabling easy integration with other components to meet various system requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile of this package style contribute to space-saving designs and facilitate efficient heat dissipation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this DRAM can withstand demanding environments, ensuring reliable performance even under harsh conditions.

Organization: 4MX32

The 4MX32 organization allows for a large memory capacity, accommodating extensive data storage needs in applications such as servers and high-performance computers.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C guarantees reliable operation in extreme cold environments, making this DRAM suitable for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and resistance to corrosion, enhancing the longevity and reliability of this DRAM.

Terminal Position: DUAL

With dual terminal positions, this DRAM can be mounted in different orientations, increasing versatility and ease of integration into various systems.

No. of Ports: 1

This DRAM offers a single port, simplifying system design and providing efficient data access.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2 mm ensures compatibility with compact designs and allows for the efficient utilization of space in electronic devices.

Width: 10.16 mm

The width of 10.16 mm offers a compact footprint, making this DRAM suitable for applications with limited space.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3V, this DRAM can operate efficiently and reliably even at lower power levels, making it suitable for energy-sensitive applications.

Length: 22.22 mm

The length of 22.22 mm allows for compact placement in various system designs, maximizing flexibility and accommodating constrained spaces.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this DRAM can operate reliably within a wide range of temperature conditions, making it suitable for industrial applications.

Access Mode: FOUR BANK PAGE BURST

The four-bank page burst access mode enhances memory access efficiency, improving overall performance in data-intensive applications.

Technology: CMOS

Based on CMOS technology, this DRAM offers low power consumption, high speed, and compatibility with a wide range of systems, making it a versatile choice.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical strength and ease of soldering, ensuring secure connections and reliability.

No. of Words: 4194304 words

With a high number of words, this DRAM offers a large memory capacity, perfect for applications requiring extensive data storage.

Memory Width: 32

The memory width of 32 bits ensures efficient data transfer and compatibility with various systems, making this DRAM a versatile choice.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for precise and compact connections, facilitating integration into space-constrained designs.

No. of Words Code: 4M

The 4M words code signifies a high memory capacity, suitable for data-intensive applications, providing ample storage for complex tasks.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this DRAM can handle power fluctuations and maintain stable operation, ensuring data integrity in demanding environments.

Memory Density: 134217728 bit

The high memory density of 134217728 bits enables extensive data storage and processing capabilities, suitable for demanding applications requiring large-scale memory usage.

Memory IC Type: SYNCHRONOUS DRAM

With the synchronous DRAM type, this memory IC offers high-speed data access and synchronization with the system, enhancing overall performance.

Maximum Access Time: 5.4 ns

The maximum access time of 5.4 ns ensures quick data retrieval and efficient processing, making this DRAM ideal for applications requiring high-speed operation.

Technical Specifications

DRAM MT48LC4M32B2P-6AXIT:LTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PDSO-G86

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

86

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

MT48LC4M32B2P-6AXIT:LTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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