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MT48LC4M32B2P-6A:LTR

Micron Technology

MT48LC4M32B2P-6A:LTR by Micron Technology

Micron Technology's MT48LC4M32B2P-6A:LTR is a 3.3V Synchronous DRAM with 4MX32 organization, operating at 0-70°C. Featuring self-refresh and four-bank page burst access mode, it offers a memory density of 134217728 bits for commercial applications requiring fast access times of up to 5.4 ns.

Median Price

$6.990

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 610 parts In-Stock

1+ parts

$6.990

100+ parts

$6.001

1k+ parts

$5.661

10k+ parts

$4.919

610

$6.990

$6.001

$5.661

$4.919

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.840

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$5.840

-

-

-

Vyrian

USA . 7,509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,509

-

-

-

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Digiode

USA . 268 parts In-Stock

1+ parts

-

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268

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-

ARCO, INC.

USA . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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14

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,084 parts In-Stock

1+ parts

$3.115

100+ parts

-

1k+ parts

-

10k+ parts

-

2,084

$3.115

-

-

-

Aztec Data Supply Inc.

USA . 60 parts In-Stock

1+ parts

$5.710

100+ parts

-

1k+ parts

-

10k+ parts

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60

$5.710

-

-

-

Ampacity Inc.

Singapore . 226 parts In-Stock

1+ parts

$5.940

100+ parts

-

1k+ parts

-

10k+ parts

-

226

$5.940

-

-

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AZTECH Wire

Italy . 760 parts In-Stock

1+ parts

$9.079

100+ parts

-

1k+ parts

-

10k+ parts

-

760

$9.079

-

-

-

Semicontronic

India . 472 parts In-Stock

1+ parts

$12.930

100+ parts

$12.607

1k+ parts

$12.542

10k+ parts

-

472

$12.930

$12.607

$12.542

-

Perfect Parts

USA . 8,960 parts In-Stock

1+ parts

-

100+ parts

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8,960

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Microchip USA

USA . 5,477 parts In-Stock

1+ parts

-

100+ parts

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5,477

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-

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Continental Prestige Electronics

USA . 5,231 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,231

-

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$5.724

1k+ parts

$5.548

10k+ parts

$5.432

1,000

-

$5.724

$5.548

$5.432

Argo Parts USA

USA . 622 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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622

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Corphita

USA . 78 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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78

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Overview

Elevate your devices to new heights with the MT48LC4M32B2P-6A:LTR by Micron Technology. This top-of-the-line DRAM offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. With its advanced technology and innovative design, this product ensures optimal performance and seamless operation. Trust Micron Technology to deliver cutting-edge solutions that exceed expectations and unlock endless possibilities for your devices. Choose the MT48LC4M32B2P-6A:LTR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides sturdiness and durability, ensuring the product is reliable for long-term use.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for precise coordination and synchronization of data transfers, leading to efficient performance.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage ensures compatibility with standard power sources and helps in efficient power consumption.

Memory Density: 134217728 bit

The high memory density of 134217728 bits allows for storing a large amount of data, making it suitable for demanding applications.

Technical Specifications

DRAM MT48LC4M32B2P-6A:LTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PDSO-G86

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

86

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4MX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC4M32B2P-6A:LTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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