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MT47H64M8SH-25EIT:H

Micron Technology

MT47H64M8SH-25EIT:H by Micron Technology

Micron Technology's MT47H64M8SH-25EIT:H is a DDR2 DRAM with 64MX8 organization, operating at 400 MHz. It features a 60-terminal grid array package, suitable for industrial applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.

Median Price

$19.381

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 7,438 parts In-Stock

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Vyrian

USA . 4,754 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,675 parts In-Stock

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2,675

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Digiode

USA . 1,900 parts In-Stock

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1,900

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Micros

Poland . 10 parts In-Stock

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$19.424

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$19.424

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Partservice

France . 10 parts In-Stock

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$17.736

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$17.736

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$17.736

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$17.736

$17.736

$17.736

Micros sp.j. W. Kędra i J. Lic

Poland . 10 parts In-Stock

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$18.998

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$18.998

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$18.998

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$18.998

$18.998

$18.998

Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 185 parts In-Stock

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$15.400

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$15.400

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Ampacity Inc.

Singapore . 1,060 parts In-Stock

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$25.000

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$25.000

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RC Electronics

USA . 49,776 parts In-Stock

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A-Z Elektronik GmbH

Germany . 13,652 parts In-Stock

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S.R.D Solutions

India . 4,009 parts In-Stock

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Continental Prestige Electronics

USA . 2,386 parts In-Stock

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Kepictronics

USA . 2,340 parts In-Stock

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Corphita

USA . 1,872 parts In-Stock

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Argo Parts USA

USA . 1,464 parts In-Stock

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Microchip USA

USA . 458 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Upgrade your electronic devices with the cutting-edge MT47H64M8SH-25EIT:H by Micron Technology. As a leading manufacturer in the industry, Micron Technology delivers top-quality DRAM products that are ideal for a wide range of applications. Experience seamless performance and reliability with this synchronous memory module, featuring common input/output types and self-refresh capabilities. With a nominal supply voltage of 1.8V and a maximum clock frequency of 400 MHz, this DDR2 DRAM offers exceptional value and benefits to customers seeking high-performance memory solutions. Elevate your technology experience with Micron Technology's innovative memory products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DRAM, ensuring longevity and reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination between different components, leading to efficient data transfer and processing.

Nominal Supply Voltage / Vsup (V): 1.8

Runs on a low voltage of 1.8V, making it energy efficient and suitable for a variety of applications.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments, ensuring stability and performance even under challenging conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, making it a cost-effective and high-performance choice.

Technical Specifications

DRAM MT47H64M8SH-25EIT:H attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

400 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

4,8

JESD-30 Code:

R-PBGA-B60

JESD-609 Code:

e1

Length:

10 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

60

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA60,9X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

4,8

Maximum Standby Current:

.01 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

150 mA

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

MT47H64M8SH-25EIT:H Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.28

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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