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S27KS0642GABHV020

Infineon Technologies

S27KS0642GABHV020 by Infineon Technologies

S27KS0642GABHV020 by Infineon Technologies is a 8MX8 DRAM with synchronous operation, self-refresh capability, and 200 MHz clock frequency. It is ideal for applications requiring high-speed memory access in compact devices due to its very thin profile package style and common I/O type.

Median Price

$4.515

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 371 parts In-Stock

1+ parts

$3.130

100+ parts

$2.860

1k+ parts

$2.720

10k+ parts

-

371

$3.130

$2.860

$2.720

-

Newark

USA . 373 parts In-Stock

1+ parts

$4.400

100+ parts

$3.800

1k+ parts

$3.470

10k+ parts

-

373

$4.400

$3.800

$3.470

-

Chip1Stop

Japan . 301 parts In-Stock

1+ parts

$4.630

100+ parts

$4.050

1k+ parts

-

10k+ parts

-

301

$4.630

$4.050

-

-

DigiKey

USA . 56 parts In-Stock

1+ parts

$4.640

100+ parts

$4.004

1k+ parts

$3.739

10k+ parts

$3.684

56

$4.640

$4.004

$3.739

$3.684

Mouser Electronics

USA . 1,673 parts In-Stock

1+ parts

$5.150

100+ parts

$4.090

1k+ parts

$3.820

10k+ parts

$3.760

1,673

$5.150

$4.090

$3.820

$3.760

Element14

Singapore . 371 parts In-Stock

1+ parts

$5.850

100+ parts

$5.250

1k+ parts

$4.940

10k+ parts

-

371

$5.850

$5.250

$4.940

-

Rochester

USA . 910 parts In-Stock

1+ parts

-

100+ parts

$2.670

1k+ parts

$2.390

10k+ parts

$2.250

910

-

$2.670

$2.390

$2.250

Verical

USA . 338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.987

10k+ parts

$2.813

338

-

-

$2.987

$2.813

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 200 parts In-Stock

1+ parts

$2.660

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$2.660

-

-

-

Nova Conductors

Japan . 74 parts In-Stock

1+ parts

$4.315

100+ parts

-

1k+ parts

-

10k+ parts

-

74

$4.315

-

-

-

Flip Electronics

USA . 10,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,478

-

-

-

-

Vyrian

USA . 111 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

111

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 2,000 parts In-Stock

1+ parts

$1.220

100+ parts

$1.220

1k+ parts

$3.660

10k+ parts

-

2,000

$1.220

$1.220

$3.660

-

Ampacity Inc.

Singapore . 286 parts In-Stock

1+ parts

$1.990

100+ parts

-

1k+ parts

-

10k+ parts

-

286

$1.990

-

-

-

Corphita

USA . 234 parts In-Stock

1+ parts

$2.520

100+ parts

-

1k+ parts

-

10k+ parts

-

234

$2.520

-

-

-

Modulus Dynamics

Lithuania . 3,455 parts In-Stock

1+ parts

$2.571

100+ parts

$2.468

1k+ parts

$2.365

10k+ parts

-

3,455

$2.571

$2.468

$2.365

-

Continental Prestige Electronics

USA . 471 parts In-Stock

1+ parts

$4.080

100+ parts

$3.210

1k+ parts

-

10k+ parts

-

471

$4.080

$3.210

-

-

Argo Parts USA

USA . 4,779 parts In-Stock

1+ parts

$4.315

100+ parts

-

1k+ parts

-

10k+ parts

-

4,779

$4.315

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,405

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the S27KS0642GABHV020 by Infineon Technologies. This high-quality DRAM module offers unparalleled performance and reliability, perfect for a wide range of applications. Experience seamless operation in synchronous mode with self-refresh capabilities, ensuring smooth and efficient data processing. With a compact grid array package and very thin profile design, this memory module is ideal for space-constrained environments. Trust in the industry-leading manufacturer, Infineon Technologies, to deliver top-tier products that exceed expectations. Elevate your projects with the S27KS0642GABHV020 and enjoy the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for the product.

Surface Mount: YES

Easy to install and saves space on the PCB.

Operating Mode: SYNCHRONOUS

Enhanced performance and efficiency during data transfer.

Nominal Supply Voltage / Vsup (V): 1.8

Optimal voltage for efficient operation.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation.

Memory IC Type: HYPERRAM

HYPERRAM provides high-performance memory capabilities.

Technical Specifications

DRAM S27KS0642GABHV020 attributes and parameters. Explore more DRAM devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

200 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Self Refresh:

YES

Maximum Standby Current:

.00033 Amp

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S27KS0642GABHV020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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