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MT41K256M16TW-107AT:P

Micron Technology

MT41K256M16TW-107AT:P by Micron Technology

Micron Technology's MT41K256M16TW-107AT:P is a DDR3L DRAM with 256MX16 organization, operating at 1.35V. It features synchronous operation, self-refresh capability, and industrial temperature grade suitability. Ideal for applications requiring high memory density and multi-bank page burst access mode in thin profile grid array packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,778 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,778

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Digiode

USA . 1,816 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,816

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,365 parts In-Stock

1+ parts

$13.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,365

$13.000

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AZTECH Wire

Italy . 290 parts In-Stock

1+ parts

$17.503

100+ parts

-

1k+ parts

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10k+ parts

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290

$17.503

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Component Stockers USA

USA . 554 parts In-Stock

1+ parts

$99.990

100+ parts

$99.990

1k+ parts

$99.990

10k+ parts

$99.990

554

$99.990

$99.990

$99.990

$99.990

Corphita

USA . 1,197 parts In-Stock

1+ parts

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1,197

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

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450

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Microchip USA

USA . 298 parts In-Stock

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298

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Overview

Elevate your technology with the MT41K256M16TW-107AT:P by Micron Technology. As a leading manufacturer in the industry, Micron Technology delivers top-quality DRAM products that are perfect for a variety of applications. This DDR3L DRAM offers customers exceptional value with its high performance and reliability. Whether you're looking to enhance your gaming experience, boost your computer's speed, or improve overall system efficiency, this memory module is the perfect choice. Upgrade to Micron Technology and experience the difference in your technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making it a reliable choice for various applications.

Surface Mount: YES

This feature allows for easy installation and integration onto circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape ensures efficient use of space, making it suitable for compact designs.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster and more synchronized data transfer, improving overall system performance.

Self Refresh: YES

Self-refresh capability helps in conserving power and maintaining data integrity during standby or idle modes.

Nominal Supply Voltage / Vsup (V): 1.35

The low voltage requirement helps in reducing power consumption and heat generation, enhancing energy efficiency.

No. of Terminals: 96

With a high number of terminals, this DRAM module offers enhanced connectivity and data transfer capabilities.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style provides a compact form factor, ideal for space-constrained applications.

Maximum Operating Temperature: 105 °C

The high operating temperature range ensures reliable performance even in demanding environments.

Organization: 256MX16

The organization of 256MX16 allows for efficient data storage and retrieval, meeting the needs of data-intensive applications.

Technical Specifications

DRAM MT41K256M16TW-107AT:P attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

14 mm

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

MT41K256M16TW-107AT:P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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