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MPF100TLS-FCSG325I

Microchip Technology

MPF100TLS-FCSG325I by Microchip Technology

MPF100TLS-FCSG325I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 170 inputs and outputs. It has a package style of GRID ARRAY, LOW PROFILE, FINE PITCH and can operate in temperatures ranging from -40 to 100 °C. This FPGA is suitable for applications requiring programmable ICs with high input/output capabilities.

Median Price

$251.620

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Microchip Technology

USA . 1,103 parts In-Stock

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$211.960

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DigiKey

USA . 16 parts In-Stock

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$211.960

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Arrow

USA . 2 parts In-Stock

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$302.840

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$291.280

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Verical

USA . 2 parts In-Stock

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Digiode

USA . 350 parts In-Stock

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$287.698

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Vyrian

USA . 6,493 parts In-Stock

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Chip Stock

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Nova Conductors

Japan . 300 parts In-Stock

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AZTECH Wire

Italy . 662 parts In-Stock

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$17.437

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Corohmni

South Africa . 233 parts In-Stock

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$27.697

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Aztec Data Supply Inc.

USA . 3,112 parts In-Stock

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$139.309

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Ampacity Inc.

Singapore . 7 parts In-Stock

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$247.590

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Semicontronic

India . 7 parts In-Stock

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$247.590

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$241.400

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Corphita

USA . 107 parts In-Stock

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$272.556

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Vigor

Singapore . 200 parts In-Stock

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$304.960

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Montano Global Distributors

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NIA Electronics

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Ledger Components

France . 4,665 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,942 parts In-Stock

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Continental Prestige Electronics

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Aranea Global

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Argo Parts USA

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LMD Electronica

Estonia . 1,331 parts In-Stock

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Overview

Discover the MPF100TLS-FCSG325I by Microchip Technology, a top-tier manufacturer known for delivering exceptional quality products. This field-programmable gate array (FPGA) offers unparalleled value and advantages to customers in various applications. With its cutting-edge CMOS technology and 170 inputs and outputs, this FPGA provides the flexibility and reliability needed for your project's success. Experience the benefits of its low-profile package, fine pitch style, and robust construction, making it ideal for demanding environments. Unlock the full potential of your designs with the MPF100TLS-FCSG325I and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction of the package body enhances the durability and reliability of the FPGA, making it suitable for a wide range of applications.

Surface Mount: YES

With its surface mount capability, this FPGA allows for more efficient and compact PCB designs, optimizing space utilization within electronic devices.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage provided by this FPGA ensures stable and reliable operation, even in demanding applications that require a robust power supply.

Technology Used: CMOS

The CMOS technology employed in this FPGA offers low power consumption, allowing for efficient energy usage and prolonged battery life in portable devices.

No. of Inputs: 170

With a substantial number of inputs, this FPGA provides flexibility and versatility in handling complex data processing tasks, making it suitable for applications in digital signal processing and multimedia.

Package Shape: SQUARE

The square shape of the package enables easier integration and placement of the FPGA within circuit boards, simplifying the assembly process.

Form Of Terminal: BALL

The use of ball terminals allows for dependable electrical connections, enabling the FPGA to reliably transmit and receive data signals without signal degradation.

Nominal Supply Voltage (V): 1

The FPGA's nominal supply voltage of 1V ensures compatibility with commonly available power sources, simplifying the design and integration process.

No. of Terminals: 325

With a large number of terminals, this FPGA enables the connection of various external components and interfaces, facilitating seamless and versatile integration into any system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field programmable gate array, this IC type provides the flexibility to reconfigure the design and functionality of the FPGA, allowing for customization and adaptability in numerous applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style, combined with a low profile and fine pitch, enables high-density PCB layouts, increasing the number of available pins and enhancing the overall performance of the FPGA.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage capability of this FPGA allows for reliable operation even in low-power scenarios, making it suitable for battery-powered devices and energy-efficient applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand demanding environmental conditions, ensuring continuous and reliable operation in harsh environments.

Pitch Of Terminal: 0.5 mm

The small pitch of the terminal enables the FPGA to support high-density interconnects, facilitating improved signal integrity and reducing noise interference within the circuitry.

Minimum Operating Temperature: -40 °C

The FPGA's ability to operate in extremely low temperatures enables its deployment in various industrial, automotive, and aerospace applications that require reliable performance in harsh cold environments.

Position Of Terminal: BOTTOM

The terminal positioned at the bottom offers ease of connectivity and reduces the risk of accidental damage, ensuring stable connections and straightforward integration.

Maximum Seated Height: 1.45 mm

The low seated height of this FPGA allows for compact and slim designs, saving valuable space in electronic devices and enabling sleeker product form factors.

Width: 11 mm

The moderate width of the FPGA contributes to its versatility, facilitating its integration into a wide range of systems, including both compact and larger-scale designs.

No. of Outputs: 170

With numerous outputs, this FPGA delivers extensive processing capabilities, effectively handling data transmission and generating desired output signals, making it suitable for applications requiring complex processing and control.

Length: 11 mm

The compact length of the FPGA enables flexible placement on PCB layouts while ensuring optimal utilization of available space within electronic devices.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100TLS-FCSG325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Inputs:

170

No. of Outputs:

170

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

11 mm

Width:

11 mm

Maximum Seated Height:

1.45 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

Trade Compliance

MPF100TLS-FCSG325I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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