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MPF100TL-FCSG325E

Microchip Technology

MPF100TL-FCSG325E by Microchip Technology

MPF100TL-FCSG325E by Microchip is a CMOS FPGA with 170 inputs/outputs, 0.97-1.03 V supply voltage range, and 0-100°C operating temperature. Ideal for applications requiring high-density programmable logic in a compact grid array package.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 654 parts In-Stock

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Ampacity Inc.

Singapore . 918 parts In-Stock

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Semicontronic

India . 505 parts In-Stock

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Aztec Data Supply Inc.

USA . 667 parts In-Stock

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Corohmni

South Africa . 277 parts In-Stock

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Vigor

Singapore . 536 parts In-Stock

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Montano Global Distributors

Canada . 8,237 parts In-Stock

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NIA Electronics

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Ledger Components

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LOOK Integrated Logistics

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Continental Prestige Electronics

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LMD Electronica

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Corphita

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Overview

Discover the cutting-edge technology of the MPF100TL-FCSG325E by Microchip Technology, a top-of-the-line Field Programmable Gate Array (FPGA) that delivers unmatched performance and versatility. With 170 inputs and outputs, this FPGA is perfect for a wide range of applications. Manufactured with high-quality materials and advanced CMOS technology, this product offers customers exceptional value and benefits. Whether you're looking to optimize your production processes or streamline your design projects, the MPF100TL-FCSG325E is the perfect solution for all your FPGA needs. Experience the difference with Microchip Technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness to the product.

Surface Mount: YES

Allows for easy installation and replacement of the FPGA.

Maximum Supply Voltage: 1.03 V

Provides stable and reliable operation within safe voltage limits.

Technology Used: CMOS

Offers low power consumption and high-performance capabilities.

No. of Inputs: 170

Provides flexibility for a wide range of input signals.

Package Shape: SQUARE

Allows for efficient use of space on circuit boards.

Form Of Terminal: BALL

Enables secure connections and improved signal transmission.

No. of Terminals: 325

Offers ample connectivity options for various applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for customization and flexibility in circuit design.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

Ensures a compact and efficient form factor for tight spaces.

Minimum Supply Voltage: 0.97 V

Provides a stable operation even at lower voltages.

Maximum Operating Temperature: 100 °C

Ensures reliable performance even in high-temperature environments.

Pitch Of Terminal: 0.5 mm

Enables high-density routing and compact board designs.

Minimum Operating Temperature: 0 °C

Provides reliability even in low-temperature conditions.

Position Of Terminal: BOTTOM

Facilitates easy and secure mounting on the circuit board.

Maximum Seated Height: 1.45 mm

Helps in achieving a slim profile for space-constrained applications.

Width: 11 mm

Offers a compact footprint for efficient use of PCB space.

No. of Outputs: 170

Provides flexibility for a wide range of output signals.

Length: 11 mm

Ensures a compact size for fitting into various electronic devices.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF100TL-FCSG325E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Inputs:

170

No. of Outputs:

170

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

11 mm

Width:

11 mm

Maximum Seated Height:

1.45 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

Trade Compliance

MPF100TL-FCSG325E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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