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DSPIC33FJ64GS406T-50I/PT

Microchip Technology

DSPIC33FJ64GS406T-50I/PT by Microchip Technology

DSPIC33FJ64GS406T-50I/PT by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 85°C. Ideal for industrial applications requiring digital signal processing and control tasks due to its CMOS technology and FLASH ROM programmability. Package style is flatpack, thin profile, fine pitch with quad terminals.

Median Price

$7.650

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$7.650

100+ parts

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200

$7.650

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Vyrian

USA . 6,791 parts In-Stock

1+ parts

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6,791

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.650

100+ parts

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1,000

$7.650

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Continental Prestige Electronics

USA . 51 parts In-Stock

1+ parts

$7.650

100+ parts

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1k+ parts

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10k+ parts

$7.497

51

$7.650

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$7.497

AZTECH Wire

Italy . 377 parts In-Stock

1+ parts

$18.894

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377

$18.894

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Ampacity Inc.

Singapore . 405 parts In-Stock

1+ parts

$30.000

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405

$30.000

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Fulton Briggs Corp.

USA . 7,734 parts In-Stock

1+ parts

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7,734

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Argo Parts USA

USA . 774 parts In-Stock

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774

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Overview

Unlock the power of innovation with the DSPIC33FJ64GS406T-50I/PT by Microchip Technology. As a leading manufacturer in the digital signal processors category, Microchip Technology delivers top-notch quality and reliability. This versatile product offers a wide range of applications, providing customers with advanced solutions for their projects. Experience seamless performance, efficiency, and value with the DSPIC33FJ64GS406T-50I/PT, designed to meet your unique needs and exceed your expectations. Transform your ideas into reality with this exceptional digital signal processor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and heat resistance, making the product suitable for a wide range of operating conditions.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount technology.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options without risking damage to the processor.

Screening Level: TS 16949

Ensures high quality and reliability of the product through rigorous testing and quality standards compliance.

Package Shape: SQUARE

Compact and symmetrical design for efficient use of space on PCBs.

Bit Size: 16

Suitable for a wide range of signal processing applications with moderate complexity.

Power Supplies (V): 3.3

Standard power supply voltage for compatibility with other components in the system.

No. of Terminals: 64

Sufficient number of terminals for connecting the processor with peripheral devices and components.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Allows for efficient packaging and placement on the PCB, optimizing space and signal routing.

Minimum Supply Voltage: 3 V

Provides a safe operating range for the processor, ensuring stability and longevity.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments without risk of malfunctions.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for the terminals, ensuring long-term performance.

Terminal Position: QUAD

Optimal terminal layout for efficient signal routing and connectivity.

Maximum Seated Height: 1.2 mm

Low profile design for compact and space-efficient PCB layouts.

Width: 10 mm

Compact width for versatile placement options on the PCB.

Maximum Clock Frequency: 40 MHz

High clock frequency for fast signal processing and response times.

Length: 10 mm

Compact length for efficient use of space on the PCB.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with wide temperature variations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combines signal processing and control functions in one chip, providing versatile functionality for various applications.

Technology: CMOS

Low power consumption and high noise immunity characteristics of CMOS technology.

Terminal Form: GULL WING

Robust terminal form for secure soldering and reliable connections.

Nominal Supply Voltage: 3.3 V

Standard and stable supply voltage for consistent performance of the processor.

ROM Programmability: FLASH

Allows for easy reprogramming of the ROM for firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density integration on the PCB.

Format: FLOATING POINT

Ability to perform complex mathematical calculations with high precision.

On Chip Program ROM Width: 8

Wide ROM width allows for storing a larger program code for enhanced functionality.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ64GS406T-50I/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

DSPIC33FJ64GS406T-50I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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