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DSPIC33EP128GS702-E/2N

Microchip Technology

DSPIC33EP128GS702-E/2N by Microchip Technology

DSPIC33EP128GS702-E/2N by Microchip Technology is a 16-bit DSP with 131072 ROM words and 8192 RAM words. It features 11-Ch 12-Bit ADCs, 1-Ch 12-Bit DAC, and peripherals like PWM(16) and TIMER(5). Ideal for automotive applications due to AEC-Q100 screening, it operates at up to 60 MHz with low power mode support.

Median Price

$7.110

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 580 parts In-Stock

1+ parts

$7.110

100+ parts

$5.900

1k+ parts

$5.430

10k+ parts

$5.170

580

$7.110

$5.900

$5.430

$5.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$6.275

100+ parts

-

1k+ parts

-

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1,000

$6.275

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NAC Semi

USA . 488 parts In-Stock

1+ parts

$7.400

100+ parts

$6.710

1k+ parts

$6.130

10k+ parts

-

488

$7.400

$6.710

$6.130

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Bristol Electronics

USA . 183 parts In-Stock

1+ parts

$9.296

100+ parts

$4.028

1k+ parts

$3.811

10k+ parts

-

183

$9.296

$4.028

$3.811

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Vyrian

USA . 4,568 parts In-Stock

1+ parts

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4,568

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Dan-Mar Components

USA . 183 parts In-Stock

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183

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 108 parts In-Stock

1+ parts

$5.810

100+ parts

-

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108

$5.810

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Continental Prestige Electronics

USA . 748 parts In-Stock

1+ parts

$6.275

100+ parts

-

1k+ parts

-

10k+ parts

$6.150

748

$6.275

-

-

$6.150

AZTECH Wire

Italy . 355 parts In-Stock

1+ parts

$13.016

100+ parts

-

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355

$13.016

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Argo Parts USA

USA . 4,585 parts In-Stock

1+ parts

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4,585

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West Coast Incorporated

USA . 2,162 parts In-Stock

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2,162

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Eastek

USA . 976 parts In-Stock

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976

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Overview

Unlock endless possibilities with the Microchip Technology DSPIC33EP128GS702-E/2N Digital Signal Processor. Designed for high performance and reliability, this product is perfect for a wide range of applications in various industries. With its cutting-edge technology, advanced features, and automotive-grade quality, this DSP offers unparalleled value and benefits to customers. Experience seamless connectivity, low power mode, and exceptional performance with the DSPIC33EP128GS702-E/2N - the ultimate solution for your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Bit Size: 16

Having a larger bit size allows for more complex calculations and processing capabilities.

ADC Channels: YES

Ability to convert analog signals to digital, enabling interfacing with sensor inputs.

DMA Channels: YES

Direct Memory Access channels streamline data transfer processes, improving overall performance.

Maximum Clock Frequency: 60 MHz

High clock frequency allows for fast signal processing and response times.

Connectivity: CAN(2), I2C(2), SPI(3), UART(2)

Support for multiple communication protocols enhances compatibility with various devices and systems.

Low Power Mode: YES

Enabling low power mode helps in conserving energy and extending battery life for portable applications.

Barrel Shifter: YES

Barrel shifter circuitry aids in fast and efficient arithmetic operations, enhancing processing speed.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GS702-E/2N attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N28

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

4

No. of I/O Lines:

20

No. of Serial I/Os:

4

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

RAM Words:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

.55 mm

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SPI(3), UART(2)

Peripherals:

COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT

Analog To Digital Convertors:

11-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

DSPIC33EP128GS702-E/2N Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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