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IS64C1024AL-15KLA3

Integrated Silicon Solution

IS64C1024AL-15KLA3 by Integrated Silicon Solution

IS64C1024AL-15KLA3 by Integrated Silicon Solution is a 128KX8 SRAM with 131072 words, operating at 5V. It has a max access time of 15ns and is ideal for automotive applications due to its temperature grade. The memory density is 1048576 bits in a small outline package suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 767 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 704 parts In-Stock

1+ parts

$7.674

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704

$7.674

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Aranea Global

USA . 500 parts In-Stock

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Overview

Looking for a reliable SRAM solution? Look no further than the IS64C1024AL-15KLA3 by Integrated Silicon Solution. With a reputation for high-quality products, ISS delivers superior performance and durability in every component. This versatile memory device is perfect for a wide range of applications, from automotive to industrial. Experience seamless functionality and unmatched reliability with the IS64C1024AL-15KLA3. Upgrade your system today and unlock a world of possibilities with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the SRAM, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs during manufacturing.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for fast and efficient data access, making the SRAM suitable for high-performance applications.

Nominal Supply Voltage: 5V

Operating at a standard 5V supply voltage, this SRAM is compatible with a wide range of systems and circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this SRAM can withstand harsh environmental conditions, making it suitable for automotive use.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making this SRAM energy-efficient and fast.

Memory IC Type: STANDARD SRAM

Being a standard SRAM, this memory IC offers reliable and consistent performance for various memory storage and retrieval tasks.

Maximum Access Time: 15 ns

With a fast maximum access time of 15 nanoseconds, this SRAM can quickly retrieve data, making it suitable for time-sensitive applications.

Technical Specifications

SRAM IS64C1024AL-15KLA3 attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

15 ns

JESD-30 Code:

R-PDSO-J32

Length:

20.95 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOJ

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3.76 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10.16 mm

Trade Compliance

IS64C1024AL-15KLA3 Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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