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IS64WV204816BLL-12BLA3

Integrated Silicon Solution

IS64WV204816BLL-12BLA3 by Integrated Silicon Solution

IS64WV204816BLL-12BLA3 by Integrated Silicon Solution is a 2MX16 SRAM with 33554432-bit memory density. It operates at 3V, has a max access time of 12ns, and is suitable for automotive applications. The package style is grid array with thin profile and fine pitch, making it ideal for space-constrained designs.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

< 1k

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Vyrian

USA . 286 parts In-Stock

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GLYN GmbH & Co. KG

Germany . 169 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Aztec Data Supply Inc.

USA . 20,807 parts In-Stock

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$4.252

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Corohmni

South Africa . 179 parts In-Stock

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$5.973

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AZTECH Wire

Italy . 393 parts In-Stock

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$10.018

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Argo Parts USA

USA . 4,035 parts In-Stock

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Continental Prestige Electronics

USA . 1,408 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Enhance the performance of your automotive electronics with the IS64WV204816BLL-12BLA3 by Integrated Silicon Solution. This top-quality SRAM memory chip offers fast and reliable data storage, perfect for applications requiring high-speed access. Manufactured with precision and expertise, this product ensures long-lasting durability and efficiency. Upgrade your devices today and experience the superior value and benefits this cutting-edge technology has to offer. Elevate your projects with the IS64WV204816BLL-12BLA3 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible and efficient data retrieval and processing.

Nominal Supply Voltage / Vsup (V): 3

Operating at a 3V supply voltage provides energy efficiency and compatibility with a wide range of devices.

No. of Terminals: 48

Having 48 terminals allows for a higher level of connectivity and data transfer capabilities.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the product can withstand high heat environments.

Organization: 2MX16

The organization of 2MX16 allows for efficient memory storage and retrieval processes.

Minimum Operating Temperature: -40 °C

The product can operate reliably in extremely low temperatures down to -40°C.

Maximum Seated Height: 1.2 mm

The thin profile and low seated height make the product suitable for slim and compact devices.

Width: 6 mm

The compact width of 6mm allows for space-saving integration in electronic devices.

Minimum Supply Voltage (Vsup): 2.4 V

Operating at a minimum supply voltage of 2.4V ensures compatibility with a range of power sources.

Length: 8 mm

The product's length of 8mm contributes to its compact and space-efficient design.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and performance in challenging environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance for efficient operation.

Parallel or Serial: PARALLEL

Parallel operation allows for fast data transfer and processing capabilities.

Terminal Form: BALL

Ball terminals provide secure connections and ease of installation on PCBs.

No. of Words: 2097152 words

The high number of words allows for extensive data storage capacity in the memory.

Memory Width: 16

A memory width of 16 bits enables the product to handle larger chunks of data efficiently.

Terminal Pitch: 0.75 mm

The small terminal pitch of 0.75mm enables high-density mounting and space-saving on PCBs.

No. of Words Code: 2M

The code 2M signifies a large memory capacity, providing ample storage for data-intensive applications.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V ensures stable operation and protection against voltage fluctuations.

Memory Density: 33554432 bit

The high memory density of 33554432 bits allows for efficient storage and retrieval of large amounts of data.

Memory IC Type: STANDARD SRAM

The use of standard SRAM memory IC ensures compatibility and reliability in various electronic devices.

Maximum Access Time: 12 ns

With a maximum access time of 12 nanoseconds, the product offers fast data retrieval and processing speeds.

Technical Specifications

SRAM IS64WV204816BLL-12BLA3 attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

12 ns

JESD-30 Code:

R-PBGA-B48

Length:

8 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

48

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

IS64WV204816BLL-12BLA3 Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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