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IS64C1024AL-15TLA3

Integrated Silicon Solution

IS64C1024AL-15TLA3 by Integrated Silicon Solution

IS64C1024AL-15TLA3 by Integrated Silicon Solution is a 128KX8 SRAM with 15 ns access time and 125°C max operating temp. Ideal for automotive applications, it features common I/O type, 3-STATE output characteristics, and operates at 5V supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,025 parts In-Stock

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1,025

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 433 parts In-Stock

1+ parts

$13.594

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433

$13.594

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Upgrade your electronic devices with the IS64C1024AL-15TLA3 by Integrated Silicon Solution, a top-quality SRAM memory chip designed to deliver unmatched performance and reliability. Perfect for automotive applications, this memory IC boasts a compact design, common input/output type, and 3-state output characteristics. With a maximum access time of just 15ns, this parallel memory chip ensures lightning-fast data retrieval while operating at an optimal temperature range of -40°C to 125°C. Trust ISS to provide cutting-edge technology that enhances the functionality of your products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables independent operation without a clock signal, enhancing flexibility in use.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage of 5V ensures compatibility with many systems.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with other components.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in various environments.

Organization: 128KX8

Organized as 128K x 8 configuration offers a balance between memory capacity and data width.

Output Characteristics: 3-STATE

3-state output enables multiple devices to share a common data bus effectively.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation.

Maximum Access Time: 15 ns

Low access time allows for quick data retrieval, enhancing overall system performance.

Technical Specifications

SRAM IS64C1024AL-15TLA3 attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

15 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G32

Length:

18.4 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.0005 Amp

Minimum Standby Voltage:

2 V

Maximum Supply Current:

55 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Trade Compliance

IS64C1024AL-15TLA3 Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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